Patent
Semiconductor device and method for making same
Koujiro Kameyama,Akira Suzuki,Yoshio Okayama,Mitsuo Umemoto,Kenji Takahashi,Hiroshi Terao,Masataka Hoshino +6 more
- 01 Jul 2005
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TL;DR: In this paper, a semiconductor device which assures an accurate electric and medicinal connections between electrodes by connecting the plurality of semiconductor chips having electrodes with a low melting point metallic member is presented.
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Abstract: This invention provides a semiconductor device which assures an accurate electric and medicinal connections between electrodes by connecting the plurality of semiconductor chips having electrodes with a low melting point metallic member Bump electrodes are formed on a surface of a first semiconductor chip (1) Through holes (11) are formed in a second semiconductor chip (10) Through electrodes (12) having a clearance (13) in a central part of the through hole (11) are formed A low melting point metallic member (4) is interposed between connection surfaces of the bump electrodes (3) and the through electrodes (12) A part of the low melting point metallic member, when melted is allowed to flow into the clearance (13) By this arrangement a short circuit between the bump electrodes (3, 3) caused by providing an excess amount of the low melting point member (4) in the space between adjacent bump electrodes (3) can be prevented
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Citations
Patent
Semiconductor structure and manufacturing method thereof
Shih-Wei Liang,Hsin-Yu Pan,Kai-Chiang Wu,Ching-Feng Yang,Ming-Kai Liu,Chia-Chun Miao +5 more
- 12 Jun 2015
TL;DR: In this paper, a three-dimensional stack including a first semiconductor and a second semiconductor die is connected with the first one with a bump between the first and the second.
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Patent
Semiconductor structure having recess and manufacturing method thereof
Geng-Peng Pan,Yi-Ming Chang,Chia-Sheng Lin +2 more
- 18 May 2015
TL;DR: In this article, a first isolation layer is formed on a first surface of a wafer substrate, and a conductive pad is created on the first isolate layer, such that a concave portion exposed through the first opening is formed in the conductive pads.