Reliability Analysis for Power Electronics Modules
Chris Bailey,Tim Tilford,Hua Lu +2 more
- 09 May 2007
- pp 12-17
TL;DR: In this article, the authors discuss the reliability of power electronics modules and combine numerical modeling techniques with experimentation and accelerated testing to identify failure modes and mechanisms for the power module structure and most importantly the root cause of a potential failure.
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Abstract: This paper discusses the reliability of power electronics modules. The approach taken combines numerical modeling techniques with experimentation and accelerated testing to identify failure modes and mechanisms for the power module structure and most importantly the root cause of a potential failure. The paper details results for two types of failure (i) wire bond fatigue and (ii) substrate delamination. Finite element method modeling techniques have been used to predict the stress distribution within the module structures. A response surface optimisation approach has been employed to enable the optimal design and parameter sensitivity to be determined. The response surface is used by a Monte Carlo method to determine the effects of uncertainty in the design.
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Citations
Survey on Reliability of Power Electronic Systems
Yantao Song,Bingsen Wang +1 more
TL;DR: A comprehensive review of reliability assessment and improvement of power electronic systems from three levels: 1) metrics and methodologies of reliability assess of existing system; 2) reliability improvement of existing systems by means of algorithmic solutions without change of the hardware; and 3) reliability-oriented design solutions that are based on fault-tolerant operation of the overall systems.
859
Prediction of Bond Wire Fatigue of IGBTs in a PV Inverter Under a Long-Term Operation
TL;DR: In this article, the authors proposed a Monte Carlo based analysis method to predict the lifetime consumption of bond wires of IGBT modules in a photovoltaic (PV) inverter, where variations in IGBT parameters (e.g., on-state collector-emitter voltage, lifetime models, and environmental and operational stresses are taken into account in the lifetime prediction.
Prediction of bond wire fatigue of IGBTs in a PV inverter under long-term operation
Paula Diaz Reigosa,Huai Wang,Yongheng Yang,Frede Blaabjerg +3 more
- 15 Mar 2015
TL;DR: In this paper, a Monte Carlo based analysis method was proposed to predict the lifetime consumption of bond wires in a photovoltaic (PV) inverter under long-term operation, where the parameter distributions of IGBTs due to manufacturing variation and the annual stress profiles due to intermittent nature of solar irradiance and ambient temperature were taken into consideration.
Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics
TL;DR: In this article, a mission profile-based approach for real-time life consumption estimation which can be used for reliability design of power electronics is presented, and an example of two case studies using mission profiles of a metro-system and wind-turbines applications is presented.
167
Monte Carlo Simulation With Incremental Damage for Reliability Assessment of Power Electronics
TL;DR: In this paper, a Monte Carlo simulation method based on incremental damage concept is proposed to address the issue of fault-tolerant power converters, which recursively accumulates the damage over time, making it possible to monitor the damage level of individual sample when the failure occurs, and then being used as the initial damage during the postfault operation.
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Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling
TL;DR: The main factors that could increase the lifetime expectancy of power modules in such harsh environments will be identified.
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