Patent
Process for Preparing a Polymeric Relief Structure
Cees C. Bastiaansen,Dirk J. Broer,Carlos C. Sanchez +2 more
- 07 Apr 2009
TL;DR: In this paper, a process for the preparation of a polymeric relief structure by coating a substrate with a first coating composition comprising one or more radiation-sensitive ingredients, locally treating the coated substrate with electromagnetic radiation having a periodic or random radiation-intensity pattern, forming a latent image, polymerizing and/or crosslinking the resulting coated substrate to a first-coating, is described.
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Abstract: The present invention relates to a process for the preparation of a polymeric relief structure by a) coating a substrate with a first coating composition comprising one or more radiation-sensitive ingredients, d) locally treating the coated substrate with electromagnetic radiation having a periodic or random radiation-intensity pattern, forming a latent image, e) polymerizing and/or crosslinking the resulting coated substrate to a first coating. This process is improved by applying a second coating composition on top of the first coating composition, said second coating composition comprising either an organic compound (Co) of a monomeric nature and wherein Co is also polymerized during the process, or wherein said second coating comprises a dissolved polymer (Cp). As a result a polymeric relief structure is obtained, where a substrate is coated with a functional, stacked, bi-layer, in which each layer exhibits a specific, and from each other differing function.
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Patent
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