Probe testing structure

Patent

Probe testing structure

- 05 Mar 2004

27

TL;DR: In this article, the authors propose a calibration substrate for calibrating a probe consisting of a first conductive member supported by a substrate suitable to be electrically interconnected with a first signal path of the probe.

Abstract: A calibration structure for probing devices. A calibration substrate for calibrating a probe comprising: (a) a first conductive member supported by said substrate suitable to be electrically interconnected with a first signal path of said probe; (b) a second conductive member supported by said substrate suitable to be electrically interconnected with a second signal path of said probe; (c) a third conductive member supported by said substrate suitable to be electrically interconnected with a ground path of said probe; (d) a fourth conductive member supported by said substrate suitable to be electrically interconnected with a first signal path of another probe; (e) a fifth conductive member supported by said substrate suitable to be electrically interconnected with a second signal path of said another probe; (f) a sixth conductive member supported by said substrate suitable to be electrically interconnected with a ground path of said another probe; (g) wherein said third conductive member and said sixth conductive member arc spaced apart from one another, and a resistive material extends at least 50% of the distance between said third conductive member and said sixth conductive member.

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Citations

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Probe for combined signals

Leonard Hayden, +2 more

- 05 Mar 2007

TL;DR: In this paper, a direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor.

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82

Patent

Probe for testing a device under test

K. Reed Gleason, +3 more

- 23 May 2003

TL;DR: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies is described in this paper, where the authors propose a probe-based approach for high frequency measurement.

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54

Patent

Active wafer probe

Eric W. Strid, +1 more

- 21 Dec 2004

TL;DR: In this paper, a flexible interconnection between the active circuit and a support structure is proposed for probing a semiconductor wafer that includes an active circuit, which may impose a relatively low capacitance on the device under test.

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42

Patent

Chuck for holding a device under test

John Dunklee

- 23 Oct 2007

TL;DR: In this article, the authors describe a conductive element that contacts a device under test in a location on a chink, where the device is assumed to be static and cannot be moved.

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34

Patent

Shielded probe for testing a device under test

K. Reed Gleason, +3 more

- 24 Oct 2007

TL;DR: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip as discussed by the authors.

...read moreread less

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