Optimization method for temperature cyclic stress acceleration model of semiconductor device

TL;DR: In this article, an optimization method for a temperature cyclic stress acceleration model of a semiconductor device, and belongs to the field of integrated circuits, is presented. And the method comprises the steps of performing a normal stress degradation test on a group of samples by utilizing a cyclic stressed, and performing an accelerated degradation test by utilizing anincreased constant temperaturecyclic accelerated stress; performing detection and determination on sample sensitive parameters every a certain cyclic frequency, obtaining a degradation path model, and a pseudo-life and a distribution type, and applying fitting to obtain distribution parameters.

Abstract: The invention discloses an optimization method for a temperature cyclic stress acceleration model of a semiconductor device, and belongs to the field of integrated circuits. The method comprises the steps of performing a normal stress degradation test on a group of samples by utilizing a cyclic stress, and performing an accelerated degradation test on another two groups of samples by utilizing anincreased constant temperature cyclic accelerated stress; performing detection and determination on sample sensitive parameters every a certain temperature cyclic frequency, obtaining a degradation path model, obtaining a pseudo-life and a distribution type, and performing fitting to obtain distribution parameters; calculating average lives of the samples in the normal stress degradation test andthe accelerated stress test, and calculating model parameters and acceleration factors of a to-be-assessed temperature cyclic stress acceleration model; and inferring the lives of the samples in a normal cyclic stress condition, and performing comparison with sample lives obtained by performing extrapolation through adopting different to-be-assessed stress acceleration models, wherein the model with an optimal life value is an optimal model. According to the method, the optimal temperature cyclic stress acceleration model can be accurately judged.