Patent
Optical semiconductor module and method for manufacturing same
혼모우 히로시
- 06 Sep 2001
TL;DR: In this article, an optical wave-guiding medium is allocated on a substrate and conductive resin is applied to the insulating resin and communicates with a ground plane connected with the ground terminal of the photo sensor.
read more
Abstract: It is an object of the invention to provide a optical semiconductor module, which is resisting against external noise and can be easily fabricated. The optical semiconductor module comprises an optical wave-guiding medium (5) allocated on a substrate (2), a photosensor (3) for optical to electrical converting the optical signal emitted from an output end of the optical wave-guiding medium, means (11) for optically coupling the output end of the optical wave-guiding medium with a light-receiving surface of the photosensor, insulating resin (7,8) for filling space surrounding an output part of the optical wave-guiding medium and the photosensor, and conductive resin (10), which is applied to the insulating resin and communicates with a ground plane connected with a ground terminal of the photo sensor. Insulting resin (7,8) is composed of the first resin (7), which has a refractive index being the same as that of core of the optical wave-guiding medium, and fills a space between the output end of the wave-guiding medium and the light receiving surface of the photosensor, and the second resin (8), which is sealing resin for enclosing the first resin. Means for optically coupling is constituted of a mirror, which directs a light emitted from the optical wave-guiding medium to the photosensor.
read more
Chat with Paper
AI Agents for this Paper
Find similar papers on Google Scholar, PubMed and Arxiv
Write a critical review of this paper
Analyze citations of this paper to find unaddressed research gaps
References
Patent
Remote control light receiving unit
Aoki Fumihiko,Ozawa Ko +1 more
- 28 Mar 1997
TL;DR: In this paper, a light receiving chip, a control IC chip, chip resistance 4 and chip capacitor 5 are mounted on a reed frame and these except the signal input/output terminals 1a, 1b and 1c are sealed by a translucent resin 7 which is provided with a lens part 7a in a remote control light receiving unit.
6
Patent
Optical semiconductor devic module
Mitsuo Fukuda,Sugie Toshihiko,Ichikawa Fumio,Katsufumi Sato,Tono Shunichi +4 more
- 30 Aug 1996
TL;DR: In this article, the authors presented an optical semiconductor device module where reflected light on the surfaces of optical parts is reduced by using a transparent resin resin which is transparent with respect to light transmitted through the optical fiber 5 and whose refractive index is nearly the same as that of a part where the light through the fiber 5 passes.
3
Related Papers (5)
H. Honmou
- 02 Jul 1998
Furukawa Hiroyuki,Kunikane Tatsuro,Miyata Sadayuki +2 more
- 31 Oct 1997
Yoshiki Kuhara
- 05 Mar 2004