Multiple chip integration for flat flexible electronics

TL;DR: In this paper, a technology for embedding single thin chips in flexible substrates is further investigated so that several chips might be integrated within the same substrate, which offers the possibility of reducing weight, while at the same time enhancing the mechanical flexibility of the electronic circuitry.

Abstract: These days, there is a lot of interest for making electronic devices lighter and compacter, as the electronics market is rapidly expanding with all sorts of portable devices for home and everyday use. Here, a technology for embedding single thin chips in flexible substrates is further investigated so that several chips might be integrated within the same substrate. This technology offers the possibility of reducing weight, while at the same time enhancing the mechanical flexibility of the electronic circuitry. Such an integration is particularly interesting in the area of flexible displays, where the flexibility of the display is too often hampered by the rigidity of its driving electronics.