Patent
Multichip module connector
Dimitry G. Grabbe,Iosif Korsunsky +1 more
- 26 Jun 1991
49
TL;DR: In this paper, a connector for electrically interconnecting a semi-conductor device (92) to a substrate (86) is described. But the connector is not shown to be suitable for the use of a single-input single-output (SIMO) circuit.
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Abstract: A connector (80) for electrically interconnecting a semi-conductor device (92) to a substrate (86) is disclosed. The connector (80) includes a housing (50) having parallel channels (64) for receiving the devices (92) and contact elements (10) with cantilevered spring arms (18) for electrically engaging the devices (92) and a base (12) having an edge (26) for electrically engaging a circuit (84) on the substrate (86).
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Citations
Patent
Direct die contact (DDC) semiconductor package
Alan G. Wood,Warren M. Farnworth,Ford B. Grigg,Salman Akram +3 more
- 16 Jun 1998
TL;DR: In this article, a semiconductor package and a method for fabricating the package is described, where the dice can be inserted into the channels, with the electrical connectors on the housing proximate to the solder bumps on the dice.
157
Patent
Method for packaging semiconductor dice
Warren M. Farnworth,Alan G. Wood,Trung T. Doan,John O. Jacobson +3 more
- 01 Dec 1995
TL;DR: In this article, a method for packaging a semiconductor die includes forming an additional protective layer and conductive traces on the die, which is then placed in a multi-die holder having electrical connectors for establishing an electrical connection to the conductive trace.
151
Patent
High density connector and method of manufacture
Timothy A. Lemke,Timothy W. Houtz +1 more
- 10 Oct 1997
TL;DR: In this article, electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed, and a method of manufacturing such connectors is presented, where the connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess.
141
Patent
High density semiconductor package
Warren M. Farnworth,Salman Akram,Alan G. Wood,Mike Brooks,Eugene H. Cloud +4 more
- 20 May 1998
TL;DR: In this paper, a semiconductor package and a method of fabrication are provided, which includes multiple semiconductor dice contained in a housing, and mounted on edge to a substrate, each die includes a polymer interconnect which attaches to a face of the die, and wraps around an end (or side) of a die.
130
Patent
Method and apparatus for joining printed circuit boards
Donald V. Perino,John B. Dillon +1 more
- 21 Jul 1997
TL;DR: In this article, a method and apparatus for joining printed circuit boards is described, in which a socket is attached to a mother board and a connector is connected to a daughter board.
104
References
Patent
Circuit card edge connector and terminal therefor
John E. Lopata
- 17 Aug 1989
TL;DR: In this paper, an edge connector is provided comprising a housing and a plurality of stamped and formed terminals mounted therein, which are constructed to be self-compensating for variations in the thickness of a printed circuit board and the location of mounting apertures therein.
34
Patent
High density electrical lead
William B. Mullen,Glenn F. Urbish +1 more
- 07 Jan 1985
TL;DR: In this paper, an improved electronic clip-on lead is described, which is comprised of an elongated shaft suitable for electrical connection having a front spring finger extending from one end.
17
Patent
Printed circuit board edge connector
Billy E. Olsson
- 09 May 1989
TL;DR: In this article, an electrical connector for electrically connecting a printed circuit board (6) to a cable (8) has terminals (4) which are provided therein, and the connector is rotated relative to the board, causing the terminals to resist being engaged by the board.
17
Patent
Electrical subassembly structure
William B. Mullen,James E. Van Hout,William M. Bradford +2 more
- 07 Jan 1985
TL;DR: In this article, an electrical subassembly structure of two substrates has metalized portions located adjacent to the upper and lower edges on the back of each substrate, and a clip on leads are attached to one substrate with a portion of each lead soldered to the lower edge metalized portion.
10
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