Patent
Multi-substrate electro-optical interconnection system
Antonio Fincato,Salvatore Rotolo,Enrico Stefano Temporiti Milani,Maurizio Zuffada +3 more
- 18 May 2015
11
TL;DR: In this article, a chip-to-chip optical communications system with high bit rate and high data throughput based on the use of a silicon photonic interposer is presented. But the system is not suitable for the use in the Internet of Things (IoT).
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Abstract: An intra-board chip-to-chip optical communications system has a high bit rate and high data throughput based on the use of a silicon photonic interposer. The system includes a multi-substrate electro-optical structure for communications with CMOS and/or BiCMOS IC chips of a PCB. The structure includes a multi-chip module primary substrate mounted over the supporting PCB. The multi-chip module primary substrate implements high frequency electrical interconnections between transceiver circuit chips, mounted on the silicon photonic interposer, and the IC chips.
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Citations
Patent
Method And System For Photonic Interposer
Mark Peterson,Greg Young,Peter De Dobbelaere +2 more
- 26 May 2016
TL;DR: In this paper, a photonic interposer may receive one or more continuous wave (CW) optical signals from an external optical source, either from an optical source assembly or from optical fibers coupled to the silicon photonic Interposer.
12
Patent
Method and structure for integrating photonics with CMOs
Christopher Baiocco,Douglas D. Coolbaugh,Gerald Leake +2 more
- 10 Jun 2015
TL;DR: A semiconductor structure can include an active device FET region having an FET and a photonics region having a photonic device including a waveguide as discussed by the authors, where the waveguide can be used to form a FET at a trench isolation region of a semiconductor.
8
Patent
Method And System For Large Silicon Photonic Interposers By Stitching
Peter De Dobbelaere,Attila Mekis,Gianlorenzo Masini +2 more
- 02 Jun 2016
TL;DR: In this article, the authors describe a system for large silicon photonic interposers by stitching, where the interposer includes a plurality of reticle sections: communicating an optical signal between two of the reticle segments utilizing a waveguide.
7
Patent
Electro-optical package and method of fabrication
Vivek Raghunathan,Vivek Raghuraman,Karlheinz Muth +2 more
- 24 Apr 2019
TL;DR: An electro-optical package as discussed by the authors includes an electronic integrated circuit module, a first electrooptical component, and a photonic integrated circuit, which may have a top surface facing toward and overlapping both a portion of the first Electro-Optical component and a part of the photonic Integrated Circuit.
4
Patent
Optoelectronic computing systems
Yichen Shen,Li Jing,Rumen Dangovski,Peng Xie,Huaiyu Meng,Matthew Khoury,Lu Cheng-Kuan,Gagnon Ronald,Steinman Maurice,Jianhua Wu,Hosseinzadeh Arash +10 more
- 04 Jun 2019
TL;DR: In this article, the optical modulators in the first set are configured to generate an optical input vector by modulating the plurality of light outputs provided by the light source or port based on digital input values corresponding to a first set of modulator control signals.
3
References
Device Requirements for Optical Interconnects to Silicon Chips
David A. B. Miller
- 10 Jun 2009
TL;DR: The current performance and future demands of interconnects to and on silicon chips are examined and the requirements for optoelectronic and optical devices are project if optics is to solve the major problems of interConnects for future high-performance silicon chips.
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Silicon photonics for next generation system integration platform
TL;DR: It is shown that an optical interposer is the most efficient way to cope with the various problems that a purely electronic system may encounter and will solve those interconnection problems.
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Patent
Optical ready substrates
Claes H. Bjorkman,Lawrence C. West,Dan Maydan,Samuel Broydo +3 more
- 21 Jul 2003
TL;DR: An article of manufacture comprising an optical-ready substrate made of a first semiconductor layer, an insulating layer on top of the first semiconducting layer, and an optical signal distribution circuit made up of interconnected semiconductor photonic elements and designed to provide signals to the microelectronic circuit was described in this article.
111
Patent
Method and system for a light source assembly supporting direct coupling to an integrated circuit
Michael Mack,Mark Peterson,Steffen Gloeckner,Adithyaram Narasimha,Roger Koumans,Peter De Dobbelaere +5 more
- 09 Jul 2009
TL;DR: In this paper, a light source assembly supporting direct coupling to a photonically enabled complementary metal-oxide semiconductor (CMOS) chip is described, where a laser, a microlens, a turning mirror, reciprocal and/or non-reciprocal polarization rotators, and an optical bench are used.
109
An ultra low power CMOS photonics technology platform for H/S optoelectronic transceivers at less than $1 per Gbps
Adithyaram Narasimha,Sherif Abdalla,Colin Bradbury,Aaron Clark,Jim Clymore,James Coyne,A. Dahl,Steffen Gloeckner,Alberto Gruenberg,Drew Guckenberger,Steve Gutierrez,Mark Harrison,Daniel Kucharski,Kosal Leap,Rocky LeBlanc,Y. Liang,Michael Mack,Dany Martinez,Gianlorenzo Masini,Attila Mekis,Ron Menigoz,Carl Ogden,Mark Peterson,Thierry Pinguet,John Redman,Jose Rodriguez,Subal Sahni,M. Sharp,T.J. Sleboda,Dan Song,Yanxin Wang,Brian Welch,Jeremy Witzens,Wei Xu,K. Yokoyama,Peter De Dobbelaere +35 more
- 21 Mar 2010
TL;DR: In this article, the authors demonstrated a CMOS Optoelectronic technology platform, using a 650mW 4×10-Gb/s 0.13 μm silicon-on-insulator integrated transceiver chip, co-packaged with an externally modulated laser, to enable high density data interconnects at <$1 per Gbps.
76
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