Patent
Mounting method and mounter
Masaki Hiroi,Mori Koji,Katsumi Terada,勝美 寺田,正樹 廣居,孝二 森 +5 more
- 09 Apr 2002
5
TL;DR: In this paper, a microchip can be mounted on a board while aligning the relative position accurately by using the profile in silhouette of the microchip in place of a recognition mark for alignment.
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Abstract: PROBLEM TO BE SOLVED: To provide a mounting method and a mounter in which a microchip can be mounted on a board while aligning the relative position accurately by using the profile in silhouette of the microchip in place of a recognition mark for alignment and reading out the profile in silhouette of the chip and the recognition mark for alignment of the board using a recognition means of two visual fields. SOLUTION: In the mounting method and the mounter for mounting a chip not having a recognition mark for alignment on a board disposed below while being put with the recognition mark for alignment, relative positional relation of the profile in silhouette of the chip and the recognition mark for alignment put on the board is read out and stored by the recognition means of two visual fields inserted between the chip and the board at the time of aligning them for the purpose of mounting. Based on the relative positional relation thus stored, the chip and the board are aligned with reference to the profile in silhouette of the chip and the recognition mark for alignment put on the board. COPYRIGHT: (C)2004,JPO
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Citations
Patent
Semiconductor wafer and method of testing the same
Kouichi Nagai
- 27 Jul 2007
TL;DR: In this paper, a semiconductor wafer is characterized by including a silicon substrate which includes chip regions and scribe regions, multiple-layered films formed on the silicon substrate, and a reference mark formed in at least one film constituting the multiple-layer films.
6
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Pre-alignment system and method for bonding flip chip
Tang Liang,Li Kai,Ye Lezhi +2 more
- 28 Oct 2015
TL;DR: In this paper, a pre-alignment system and a pre alignment method for bonding flip chips is presented. But the method is not suitable for high-precision chip loading.
4
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Dynamic adjusting method and device for mounting position, and mounting system
Li Junqiang,Xie Hongwei,Huang Dingliang,Ji Lei +3 more
- 12 Mar 2019
TL;DR: In this article, a dynamic adjusting method and device for a mounting position, and a mounting system is presented, which comprises a mounting device, a stripping device and a feeding device, and the dynamic adjustment method comprises the following steps of obtaining a positioning mark point image of a carrier or a product so as to obtain the position of a positioning point; sucking a material, then obtaining an image of the sucked material, and based on this, calculating outa position deviation and an angle difference value of the material, so that a first compensation value of material position and angle is obtained;
1
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Method of mounting components on a PCB
Hideki Takahashi
- 10 Mar 2006
TL;DR: In this paper, a printed wiring board includes a board recognition mark formed of a conductive foil, a first component land covered with resist, and a second component land not covered with the resist.
1
Patent
Printed wiring board for mounting components
Hideki Takahashi
- 12 Nov 2007
TL;DR: In this paper, a printed wiring board includes a board recognition mark formed of a conductive foil, a first component land covered with resist, and a second component land not covered with the resist.
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