Patent
Mounting device and mounting method
Onishi Michinaga,Iisaka Jun,Oyama Shigeto +2 more
- 17 Nov 2016
TL;DR: A mounting device for executing a mounting process of mounting a component on a board includes: a mounting head that includes at least one pickup section for picking up the component and moving the picked up component; a storage section configured to store at least a first correction value determined at a first position on XYZ axes on which the mounting head works and a second correction value at a second position different from the first position.
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Abstract: A mounting device for executing a mounting process of mounting a component on a board includes: a mounting head that includes at least one pickup section for picking up the component and moves the picked up component; a storage section configured to store at least a first correction value determined at a first position on XYZ axes on which the mounting head works and a second correction value determined at a second position different from the first position; and a control section configured to execute the mounting process by using the first correction value and/or the second correction value stored in the storage section.
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References
Patent
Electronic component mounting system and electronic component mounting method
Norihisa Yamasaki,Yasuhiro Maenishi,Yuji Nakamura +2 more
- 07 Mar 2013
TL;DR: In this paper, the exposure time for an MSD in an atmospheric exposure state is compared with exposure limit time set for the MSD and stored in a storage part, and an electronic component mounting apparatus equipped with the reel of a MSD whose exposure time exceeds the exposure limit is specified and work by the apparatus is stopped.
23
Patent
Method for correcting component mounting position and surface mounting equipment
Koichi Nishikawa,功一 西川 +1 more
- 01 Mar 2000
TL;DR: In this paper, a main control means 21 is provided for performing a preliminary operation wherein, with a dummy substrate bearing plural marks positioned at a working position, a head unit 5 is moved and a substrate recognizing camera 18 mounted on the head unit5 images each mark, a calculation means 24 wherein a deviation (error) between a mark position with the SLAM camera 18 and a theoretical position for the mark is acquired and a correction amount for the mounting position of the part by the head units 5 is acquired on the basis of the deviation, and a storage means 25 where the correction
16
Patent
Jig for detecting attaching accuracy of attaching apparatus and method for detecting attaching accuracy
Takeyoshi Isogai,Yuji Katsumi,Masaki Murai,裕司 勝見,正樹 村井,武義 磯貝 +5 more
- 05 Nov 1999
TL;DR: In this article, two detection F marks are formed within a image pickup area 176 of a CCD camera 82 on a glass substrate 170 as a substrate to be mounted, and an inspection chip 169 is attached to the glass substrate by an attaching apparatus, and the images of the F marks and an electric component provided on the glass board are picked up at the same time by a camera 82, thereby detecting the attaching accuracy.
12
Patent
Electronic component mounting device
Nishimura Keiji
- 26 Mar 2014
TL;DR: In this paper, an electronic component mounting device which allows for height position measurement depending on the required accuracy, without wasting normally usable electronic components is presented. But it is not suitable for the use of high-quality electronic components.
9
Patent
Method and machine for mounting electronic parts
Imai Yuuko,Oshima Tetsuo +1 more
- 05 Nov 1999
TL;DR: In this paper, the mounting program is corrected based on the amounts of errors and the electronic parts are mounted on the substrate 20 in accordance with the corrected mounting program by using a mounting machine equipped with a parts mounting head.
8
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