Journal Article10.1016/J.JALLCOM.2013.03.234
Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys
Wislei R. Osório,Leandro C. Peixoto,Leonardo R. Garcia,Nathalie Mangelinck-Noël,Amauri Garcia +4 more
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TL;DR: In this paper, a comparative evaluation of as-cast Sn-Bi, Sn-Ag and Sn-Zn alloys as a function of the resulting microstructural arrays with a view to application as solder materials is presented.
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About: This article is published in Journal of Alloys and Compounds. The article was published on 25 Sep 2013. The article focuses on the topics: Ultimate tensile strength & Ductility.
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Citations
Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder
TL;DR: The influence of In element on microstructure and properties of Sn-Bi based lead-free solder was investigated in this paper. But, it was not shown that the In element increased the tensile strength of the Sn matrix and increased the reaction temperature.
144
Correlation between microstructure and mechanical properties of Sn–Bi–X solders
Omid Mokhtari,Hiroshi Nishikawa +1 more
TL;DR: In this article, a comparative analysis between the microstructure and the tensile properties of eutectic Sn-Bi, (Sn-Bi) 0.5In, and (Sn−Bi) −0.5Ni solder alloys was conducted, and the shear strengths of the alloys as Cu/solder/Cu joints were evaluated.
131
Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys
TL;DR: In this article, the effects of Cu and Zn additions on microstructures, thermal and mechanical properties of Sn-Bi-based solder alloy were investigated, and it was shown that the addition of Zn further depressed the precipitation of Bi, formed uniform globular CuZn2 particles as well as flat blocky Cu5Zn8 phase.
130
Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints.
TL;DR: Ball shear tests on Sn-Bi as-soldered joints showed that the increase of Bi content in Sn- bi deteriorated the shear strength of solder joints, which suggests that the addition of Bi increased theShear resistance strength of Sn- Bi solder.
84
Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging
TL;DR: In this article, Ni functionalized Sn58Bi solder alloys were successfully synthesized and the results indicated that the elastic modulus, tensile and yield strength increase with the increasing Ni content during the solid-state aging, which can decrease the CTE and refine the microstructure of SnBi solder.
84
References
Lead-free Solders in Microelectronics
Mulugeta Abtew,Guna S Selvaduray +1 more
TL;DR: The most widely used Pb-free solders have the eutectic composition as mentioned in this paper, which has been identified as a major factor affecting alloy selection, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation.
1.9K
Properties of lead-free solder alloys with rare earth element additions
TL;DR: In this article, the effect of rare earth (RE) elements on the microstructure, mechanical properties, wetting behavior of certain Pb-free solder alloys is summarized. But, the authors do not consider the effects of RE elements on ICs.
612
Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys
TL;DR: In this paper, the microstructures and tensile properties of three typical Sn-Ag-Cu alloys, Sn-30wt%Ag-05wt%Cu and Sn-39Ag-06Cu, were evaluated after casting under three different cooling conditions.
402
Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys
TL;DR: In this article, the effects of the addition of Bi to Sn-Zn near eutectic alloy and cooling rate on the thermal and mechanical properties were investigated, and it was also confirmed that the difference of cooling rates significantly affects the microstructure and properties.
234
Correlation between unsteady-state solidification conditions, dendrite spacings, and mechanical properties of Al-Cu alloys
TL;DR: In this paper, analytical expressions have been developed describing thermal gradients and tip growth rate during one-dimensional unsteady-state solidification of alloys, and the correlation of these expressions with experimental equations relating mechanical properties and dendrite spacings provides an insight into the preprogramming of solidification in terms of casting mechanical properties.
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