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Microelectronics: Processing and device design
Roy A. Colclaser
- 01 Jan 1980
97
About: The article was published on 01 Jan 1980. and is currently open access. The article focuses on the topics: Microelectronics.
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Citations
Opportunities for mesoscopics in thermometry and refrigeration: Physics and applications
TL;DR: In this paper, a review of the thermal properties of mesoscopic structures is presented based on the concept of electron energy distribution, and, in particular, on controlling and probing it, and an immediate application of solidstate refrigeration and thermometry is in ultrasensitive radiation detection, which is discussed in depth.
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TL;DR: In this article, an insulated gate field effect transistor is constructed by first forming a non-single crystalline semiconductor layer or island on an insulating surface of a substrate, and a gate insulating layer is then formed on the semiconductor layers.
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External diffusion in solid-phase immunoassays
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Integrated circuit copper metallization process using a lift-off seed layer and a thick-plated conductor layer
Sue E. Crank
- 30 Apr 1990
TL;DR: In this paper, an improved metallized structure is formed from a copper seed layer (46) and a copper structure (48), which is then electroplated over the remaining seed layer.
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Isfet sensor and method of manufacture
Ronald D. Baxter
- 16 Jul 1984
TL;DR: In this article, an ISFET structure and a method for manufacturing that structure such that external electrical contact to the P+ source and drain regions is made through individual holes etched from the back to the source or drain regions with sidewall isolation being provided in the holes and metallization covering the surface of said sidewalls and extending to contact pads on the back.
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