Patent
Method of transferring and bonding an array of micro devices
Andreas Bibl,John A. Higginson,Hsin-Hua Hu,Hung-Fai Stephen Law +3 more
- 24 Jan 2013
82
TL;DR: In this paper, the authors described a method for transferring and bonding an array of micro devices to a receiving substrate by picking up a carrier substrate with an electrostatic transfer head assembly, contacting the receiving substrate with the array of devices, transferring energy from the electrostatic head assembly to bond the devices to the substrate, and releasing the arrays of devices onto the substrate.
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Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.
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Citations
Patent
Led display with wavelength conversion layer
Andreas Bibl,Kelly McGroddy +1 more
- 18 Jun 2013
TL;DR: In this paper, a display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum.
263
Patent
Method of fabricating a light emitting diode display with integrated defect detection test
Andreas Bibl,Kapil V. Sakariya,Charles R. Griggs,James Michael Perkins +3 more
- 15 Mar 2013
TL;DR: In this article, a display panel and method of manufacture are described, and a display substrate includes a pixel area and a non-pixel area, an array of subpixels and corresponding array of bottom electrodes are in the pixel area, and one or more top electrode layers are formed in electrical contact with the array of micro LED devices.
167
Patent
Transferring method, manufacturing method, device and electronic apparatus of micro-led
Quanbo Zou,Zhe Wang +1 more
- 21 May 2015
TL;DR: In this paper, a method for transferring micro-LEDs at wafer level is described, which consists of temporarily bonding microLEDs on a laser-transparent original substrate onto a carrier substrate via a first bonding layer; irradiating the original substrate with laser, to lift-off selected micro-LESs; performing a partial release on the first layer, to transfer the selected micro LEDs to the carrier substrate; temporarily bonding the micro LEDs on the carrier layer onto a transfer head layer via a second layer; and removing the transfer head substrate by releasing the second bonding layer,
162
Patent
Light emitting device reflective bank structure
Kapil V. Sakariya,Andreas Bibl,Hsin-Hua Hu +2 more
- 24 Sep 2015
TL;DR: Reflective bank structures for light emitting devices are described in this paper, where a reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layers with each bank opening including a bottom surface and sidewalls.
158
Patent
Method for integrating a light emitting device
Andreas Bibl,Charles R. Griggs +1 more
- 23 Jan 2015
TL;DR: In this article, a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank, where a micro LED device is within the bank structure.
154
References
Wafer-level fabrication of GaN-based vertical light-emitting diodes using a multi-functional bonding material system
Sang Youl Lee,Kwang Ki Choi,Hwan-Hee Jeong,Hee Seok Choi,Tchang-Hun Oh,June O. Song,Tae Yeon Seong +6 more
TL;DR: In this article, the fabrication of 2 inch wafer-level GaN-based vertical light-emitting diodes (LEDs) by using a multi-functional bonding material system, which is composed of a thick Cu diffusion barrier and a bonding layer, is described.
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TL;DR: In this paper, a generic cost-efficient CMOS-compatible heterogeneous device integration method at wafer-scale level is developed for the distribution of devices from one to numerous wafers using selective transfer technology.
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Patent
Method of manufacturing transferable elements incorporating radiation enabled lift off for allowing transfer from host substrate
Ingo Speier
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TL;DR: In this paper, a transfer device, intermediate substrate or target substrate is brought into adhesive contact with the semiconductor material and the radiation lift off layer is irradiated to weaken it, allowing the material to be transferred off the host substrate.
103
Patent
Device mounting substrate and method of repairing defective device
Toyoharu Oohata,Toshiaki Iwafuchi,Hisashi Ohba +2 more
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TL;DR: In this article, a method of repairing a defective one of devices mounted on a substrate is provided, in which the defective device is mounted at a position corresponding to a position of the defective devices.
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Patent
Method of electrically connecting element to wiring, method of producing light-emitting element assembly, and light-emitting element assembly
Naoki Hirao,Yasunobu Iwakoshi,Katsuhiro Tomoda,Huy Sam +3 more
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TL;DR: In this paper, a method of electrically connecting an element to wiring includes the steps of forming a conductive fixing member precursor layer at least on wiring provided on a base, and arranging an element having a connecting portion on the wiring such that the connecting portion contacts the conductive fix member preconditioned by solution-tape conductive material.
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