Patent
Method for Electrostatically Attracting and Processing a Glass Insulative Substrate
Kitabayashi Tetsuo,Hiroaki Hori,Takeshi Uchimura,Noriaki Tateno,Fuwa Koh,Ken Maehira +5 more
- 25 May 2000
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TL;DR: In this article, an electrostatic chuck for insulating substrate attraction, comprising a dielectric substrate acting on one surface thereof as an attraction surface of an insulating surface and provided on the other surface with a plurality of electrodes, is presented.
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Abstract: An electrostatic chuck for insulating substrate attraction, comprising a dielectric substrate (1a) acting on one surface thereof as an attraction surface of an insulating substrate and provided on the other surface with a plurality of electrodes (7) in order to electrostatic-attracting an insulating substrate such as a glass substrate, an insulating support base (1b) for fixing the dielectric substrate, a plurality of conducting terminals provided on the insulating support base, and a means for electrically connecting the electrodes with the conducting terminals, wherein a resistivity at room temperature of the dielectric substrate is up to 10 OMEGA cm, a thickness of the dielectric substrate up to 2 mm, a width of an electrode up to 4 mm, and an interval between electrodes up to 2 mm. A heating/cooling plate (6), a gas supply piping for supplying gas to a gap between the insulating substrate and the attraction surface, and a temperature control system for controlling the temperature of the insulating substrate are added to the above electrostatic chuck for insulating substrate attraction to constitute an insulating substrate treating device.
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Citations
Patent
Electrostatic chuck assembly
Steven V. Sansoni,Cheng-Hsiung Tsai,Shambhu N. Roy,Karl M. Brown,Vijay D. Parkhe,Hari Ponnekanti +5 more
- 06 Aug 2009
TL;DR: In this article, a dielectric body has chucking electrodes which comprise a metal matrix composite material with a coefficient of thermal expansion (CTE) that is matched to the CTE of the dielectrical body.
190
Patent
Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method
Jan Van Elp,Giessen Peter,Jacob Jan Van der Velde +2 more
- 29 Apr 2003
TL;DR: In this paper, a method of manufacturing a chuck comprising the step of joining a first glass ceramic element with a second glass element with an electrode sandwiched therebetween in which a current is passed through the second glass elements is also disclosed.
31
Patent
Plasma temperature control apparatus and plasma temperature control method
Akitoshi Okino,Hidekazu Miyahara +1 more
- 03 Sep 2009
TL;DR: In this paper, the temperature of the plasma generated in the plasma generating section 40 is controlled by controlling the plasma-generating gas temperature control section 30 that controls the temperature supplied to the plasma generator.
12
Patent
Gas-cooled clamp for rapid thermal processing
Peter L. Kellerman,Victor M. Benveniste,Frederick M. Carlson +2 more
- 29 Mar 2004
TL;DR: In this paper, a gas-cooled clamp is proposed to provide cooling of a substrate by thermal conduction generally in the free molecular regime, where the heat transfer coefficient of the cooling gas is primarily a function of the pressure and substantially independent of the gap distance.
6
References
Patent
Wafer support member
Koichi Nagasaki,Kazuhiro Kuchimachi,Saburo Nagano,Yasunori Kawanabe,Hiroshi Aida,Kenji Kitazawa +5 more
- 25 Jul 1996
TL;DR: In this paper, a wafer support member comprises a base made of ceramics with thickness of 3 mm or more, a metallic electrode plate with thickness 0.5 mm, and an attraction surface composed of an aluminum nitride film with thickness from 0.01 to 0.4 mm.
172
Patent
Wafer cooling device
Thomas W. Mountsier,James Wing +1 more
- 16 Feb 1996
TL;DR: In this article, a wafer cooling device (WCD) for cooling a substrate, such as a Wafer, during processing is presented, where the substrate is mounted to an WCD heat transfer surface, thereby forming a cavity in between the substrate and the heat-transfer surface into which gas is incorporated.
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