Method for detecting high-density packaging electronic assembly emissivity

Patent

Method for detecting high-density packaging electronic assembly emissivity

- 26 Mar 2014

2

TL;DR: In this article, a method for detecting high-density packaging electronic assembly emissivity is proposed, which comprises the step of controlling the temperature of a temperature control box to enable an electronic assembly to be stabilized around the preset value.

Abstract: The invention discloses a method for detecting the high-density packaging electronic assembly emissivity. The method comprises the step of controlling the temperature of a temperature control box to enable the temperature of an electronic assembly to be stabilized around the preset value, the step of acquiring reflected apparent temperature of components to be detected, the step of serving the acquired reflected apparent temperature of the components to be detected as compensation to the environment reflected temperature of the components to be detected, the step of respectively adjusting the emissivity of the components to be detected and detecting the temperature of the components to be detected, and the step of serving the adjustment value of the emissivity as the detecting value of the emissivity of the components to be detected when the temperature of the components to be detected is equal to the preset value. The infrared thermography detection mode and the reflected temperature compensation control technology are adopted in the method, the apparent temperature and the actual temperature of the components inside the electronic assembly are effectively detected, the emissivity of the components to be detected can be detected and modified by compensating the reflected temperature of the components to be detected, and the purpose of detecting the emissivity of the electronic assembly which is assembled in a high-density mode and is complex in packaging structure is achieved.

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Citations

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