Patent
Method for constructing a membrane probe using a depression
Reed Gleason,Michael A. Bayne,Kenneth Smith +2 more
- 16 Apr 2003
59
TL;DR: In this paper, a tool is brought into contact with the substrate and a dielectric (insulative) layer is supported by the substrate, and a polyimide layer is then patterned over the entire surface.
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Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
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Citations
Patent
Membrane probing system
Reed Gleason,Michael A. Bayne,Kenneth Smith,Timothy Lesher,Martin J. Koxxy +4 more
- 22 Mar 2001
TL;DR: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors as discussed by the authors.
101
Patent
Wafer probe station having environment control enclosure
Warren K. Harwood,Paul A. Tervo,Martin J. Koxxy +2 more
- 09 Oct 2002
TL;DR: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment.
96
Patent
Probe for combined signals
Leonard Hayden,Scott H. Rumbaugh,Mike Andrews +2 more
- 05 Mar 2007
TL;DR: In this paper, a direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor.
82
Patent
Probe card assembly
Shih-Jye Cheng,An-Hong Liu,Yeong-Her Wang,Yuan-Ping Tseng,Yao-Jung Lee +4 more
- 17 Jul 2003
TL;DR: In this paper, a probe card assembly consisting of a stiffener ring combining with an upper printed circuit board and a lower printed circuit boards is described, where a plurality of coaxial transmitters are installed in the stiffener rings, and connect to the upper and lower printed circuits by cable connectors.
72
Patent
Probe station thermal chuck with shielding for capacitive current
Clarence E. Cowan,Paul A. Tervo,John Dunklee +2 more
- 24 Jun 2002
TL;DR: In this article, a conductive member is arranged to intercept current coupling the thermal unit of a thermal chuck to the surface supporting the device, but free of direct electrical connection to the unit.
62
References
Patent
Method of manufacturing electrical contacts, using a sacrificial member
Igor Y. Khandros
- 16 Nov 1993
TL;DR: In this paper, a method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensional).
311
Patent
Contact carriers (tiles) for populating larger substrates with spring contacts
Igor Y. Khandros,Benjamin N. Eldridge,Gaetan L. Mathieu,II Thomas H. Dozier,William D. Smith +4 more
- 23 Oct 2003
TL;DR: In this article, the first substrate is attached to a second substrate, which is larger than the first, and multiple such first substrates may be attached to the second substrate in order to create an array of contact structures.
308
Patent
Probe card assembly and kit, and methods of making same
Benjamin N. Eldridge,Gary W. Grube,Igor Y. Khandros,Gaetan L. Mathieu +3 more
- 27 Dec 2001
TL;DR: In this article, a probe card assembly is described, which includes a probe, a space transformer, and an interposer disposed between the space transformer and the probe card to ensure that electrical connections are maintained between the transformer and probe card throughout the transformer's range of adjustment.
290
Patent
Electrical circuit board interconnect
Mark S. Zifcak,Bruce G. Kosa,Scott S. Simpson,Herman B. Gordon,Richard C Berry,Jeffrey B. Otto,Richard T. Traskos,Claudette M. Hoffman +7 more
- 15 Jan 1987
TL;DR: In this paper, an area array connector device for providing electrical interconnection from contacts on a first printed circuit board surface (15) to corresponding contacts on the second opposed surface (17) consists of an electrically nonconductive support member (13) disposed between opposed board surfaces, the support member having apertures therethrough in regions corresponding to alignment of corresponding opposed pairs of contacts (34, 36), and electrically conductive metallic interconnect members (22) extending in elastomeric material in the regions.
272
Patent
Lithographic contact elements
Gaetan L. Mathieu,Benjamin N. Eldridge,Gary W. Grube +2 more
- 01 Dec 1999
TL;DR: In this article, a method of forming an interconnection, including a spring contact element, by lithographic techniques is described. But, the method requires the first portion of the spring structure to be free of masking material.
272
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