Patent
Measuring substrate, substrate table, lithographic apparatus, calculating method for alignment beam angle in alignment system, and alignment verification system
Fransiscus Godefridus Casper Bijnen,Geoffrey Norman Phillipps,Erik Marie Jose Smeets,マリー ホセ スメーツ エリック,ノーマン フィリップス ジェフリー,ゴーデフリデュス キャスパー ビユネン フランシスクス +5 more
- 14 Oct 2005
3
TL;DR: In this article, the alignment beam angle of the alignment system of a lithography apparatus is calculated using the distance between two alignment marks, and the alignment marks are formed on a measuring substrate, or arranged on a substrate table of the lithography equipment.
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Abstract: PROBLEM TO BE SOLVED: To improve a calculating method for an alignment beam angle of an alignment system, and a verification method for front surface-rear surface alignment (FTBA) error. SOLUTION: To calculate the alignment beam angle of the alignment system of a lithography apparatus, two alignment mark positions are measured, and the two alignment marks are formed on a measuring substrate, or arranged on a substrate table of the lithography apparatus. A second mark is covered with a transparent plate, and the two mark positions are measured with the alignment system. By refraction of the alignment beam by the transparent plate, the alignment beam returning to the alignment system shifts. The second mark is measured while being out of alignment due to shift of the alignment beam. Since the distance between two marks has been known, the shift can be calculated. The shift is used for calculation for the alignment beam angle, and the verification method for the FTBA error is improved by the angle. COPYRIGHT: (C)2006,JPO&NCIPI
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Citations
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