Open AccessJournal Article
Material classification method for printed circuit boards using a spectral imaging system
TL;DR: A spectral imaging system for observing the minute details of the board and capturing their spectral data is developed and a rule for classifying the objects into six element materials by means of surface-spectral reflectance is presented.
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Abstract: This paper proposes a method for classifying object materials on a raw circuit board into element materials by means of surface-spectral reflectance. First, we develop a spectral imaging system for observing the minute details of the board and capturing their spectral data. Second, the surface-spectral reflectance functions of the board are estimated by a direct method using narrow band sensor outputs. We investigate the reflection properties of various objects on the board under different illumination directions. Third, we find key features of the body spectral reflectances for different materials, and present a rule for classifying the objects into six element materials. Finally, experiments are executed using a real circuit board. The observed spectral reflectance image is segmented into the element material areas. The performance and robustness of the proposed method are examined in detail in comparison with other methods.
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A tiered-color illumination approach for machine inspection of solder joints
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Spectral imaging by a multichannel camera
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