Journal Article10.1016/0040-6090(75)90051-6
Mass transport during electromigration in aluminum-magnesium thin films☆
A. Gangulee,François M. d'Heurle +1 more
32
TL;DR: In this paper, single-crystal and polycrystalline aluminum thin film conductors, containing up to 6 at.% magnesium, were subjected to electromigration experiments at 175° and 225°C with current densities up to 4 × 106 A/cm2 and for times up to 50 000 h.
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About: This article is published in Thin Solid Films. The article was published on 01 Feb 1975. The article focuses on the topics: Electromigration & Magnesium.
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Citations
Atomistic study of grain-boundary segregation and grain-boundary diffusion in Al-Mg alloys
R.K. Koju,Yuri Mishin +1 more
TL;DR: In this article, the authors applied atomistic computer simulations to predict the amount and the free energy of Mg grain boundary (GB) segregation, and the impact of segregation on GB diffusion of both alloy components.
125
A molecular dynamics study of self-diffusion in the cores of screw and edge dislocations in aluminum
G. P. Purja Pun,Yuri Mishin +1 more
TL;DR: In this article, self-diffusion along screw and edge dislocations in Al is studied by molecular dynamics simulations and the intrinsic diffusion mechanism is associated with the formation of dynamic Frenkel pairs, possibly activated by thermal jogs and/or kinks.
95
Simulation of the effects of grain structure and grain growth on electromigration and the reliability of interconnects
TL;DR: In this paper, a grain growth simulator has been used to model the microstructural evolution of a film during processing, both prior to and after patterning, and the failure distributions and overall reliability of the interconnects are obtained, and conditions under which a transition-in-failure mechanism will occur are predicted.
75
The effects of microstructural transitions at width transitions on interconnect reliability
TL;DR: In this paper, the authors carried out experimental and modeling-based studies of interconnects with narrow-to-wide transitions to test the Korhonen model for electromigration-induced failure and determine parameters for failure.
73
Characteristics of diffusion in Al-Mg alloys with ultrafine grain sizes
TL;DR: In this paper, equal-channel angular pressing (ECAP) was used to refine the grain sizes of pure Al and an Al 3 wt% Mg alloy containing minor additions of either Sc or Zr.
68
References
•Book
Anelastic Relaxation in Crystalline Solids
A. S. Nowick,B. S. Berry,J. Lawrence Katz +2 more
- 01 Jan 1972
2.8K
Impurity Diffusion in Aluminum
N. L. Peterson,Steven J. Rothman +1 more
TL;DR: In this paper, the diffusion coefficients of aluminum single crystals were measured by tracer-sectioning technique and the results showed that the activation energies obtained in this study cannot be reconciled with the large impurity-vacancy binding energies deduced from quenching studies; the difference is explained in terms of clustering effects in the quench experiments.
341
Current-induced mass transport in aluminum☆
TL;DR: The motion of transverse scratches on the surface of aluminum specimens carrying current densities of about 10 4 A cm 2 was observed as a function of temperature from 460 to 640°C, for periods of several days as discussed by the authors.
119