Patent
Laser processing system and method
Xu Wen,Song Chunfeng,Wang Fan +2 more
- 11 Jul 2017
8
TL;DR: In this article, a laser processing system consisting of a laser machine, an optical system, a sensor, a processor and a controller is described, where the laser machine is used for providing laser needed for processing, the optical system is arranged above a workpiece table, and projecting the adjusted laser spot onto the table, the sensor is connected with the processor and used for receiving the information of the processor to control the laser system.
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Abstract: The invention discloses a laser processing system and method. The laser processing system comprises a laser machine, an optical system, a sensor, a processor and a controller, wherein the laser machine is used for providing laser needed for processing, the optical system is arranged above a workpiece table and is used for adjusting the size of a laser spot, and projecting the adjusted laser spot onto the workpiece table, the sensor is arranged above the workpiece table and is used for collecting parameter information of workpiece material, the processor is connected with the sensor and is used for receiving and processing the parameter information acquired by the sensor to obtain the size of the laser spot needed by the workpiece material, and the controller is connected with the processor and is used for receiving the information of the processor to control the optical system. According to the laser processing system, the parameter information of the workpiece material is collected in real time through the sensor, the required size of the laser spot is calculated through the processor, the laser pulse energy density is adjusted in real time by adopting the controller to control the optical system to change the size of the laser spot, so that the real-time performance is good, and the cutting efficiency is high; and in the cutting process, the laser machine outputs lasers at the rated laser power all the time, and the utilization rate of laser energy is improved.
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Citations
Patent
Control method, control device, terminal, computing device, and storage medium
Bai Jian
- 07 Aug 2018
TL;DR: In this article, a control method of a laser projector is presented, which consists of acquiring a projection distance between a target user and a laser projection, acquiring an energy density of the laser projector during laser projection based on a preset parameter at a current distance, adjusting a preset parameters and controlling the projector based on the adjusted parameters.
8
Patent
Method and system for wafer processing by using laser
Hou Yu,Liu Song,Zhang Zichen +2 more
- 24 Nov 2017
TL;DR: In this paper, a method and system for wafer processing by using a laser is presented, which comprises the steps that real-time laser information of a laser beam is obtained; preset laser information is received, and a first adjusting parameter of the laser beam was acquired according to the realtime laser and the preset laser.
3
Patent
Method and device for wafer processing by using laser
Liu Song,Hou Yu,Zhang Zichen +2 more
- 24 Nov 2017
TL;DR: In this article, a method and device for wafer processing by using a laser was proposed, which consisted of the following steps that a detecting light beam was launched to the Low-K layer on the upper surface of a wafer; reflected light of the detecting light was obtained; and change information of surface uniformity of the low-k layer was obtained according to the reflected light.
1
Patent
Control method and system of laser processing wafer
Zhang Zichen,Hou Yu,Liu Song +2 more
- 10 Oct 2017
TL;DR: In this paper, a control method and system of a laser processing wafer is presented, which comprises the following steps of: acquiring real-time three-dimensional position information when a wafer processing platform operates in a first position as laser exposes and labels or etches and machines a first target point of the wafer; acquiring target 3D position information of a second position and moving the Wafer Processing Platform to the second position; determining a laser offset according to the target 3d information and the real time 3d position information; and regulating a phase controlled silicon-based liquid
1
Patent
Laser cutting system and method for epoxy resin packaging sheet
Chen Chang,Liu Xiao,Tang Liheng,Yang Shenming,Zhang Hongjiang,Lu Jiangang,Yin Jiangang,Gao Yunfeng +7 more
- 11 Jan 2019
TL;DR: In this article, a laser cutting system and method for an epoxy resin packaging sheet is described, where a laser, a beam expander, a light spot shaping system, a focusing lens and an X-Y motion stage are used for fixing a to-be-cut workpiece.
1
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Kenshi Fukumitsu,Fumitsugu Fukuyo,Koji Kuno +2 more
- 04 Dec 2003
TL;DR: In this paper, a method for laser processing where laser light for processing can be collected at a predetermined position with excellent accuracy is presented, where the light collection point (P1) of the laser light (L1) for processing is prevented from being displaced from a predetermined location by vibration of a stage.
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Patent
Laser machining device and laser machining control device
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TL;DR: In this article, the authors describe a laser machining system that includes a transmission fiber (2) that transmits laser light (L) emitted from a laser oscillator (4) through the fiber, a machining head (3) that emits the laser light(L) which is sent from the transmission fiber to the main surface of the machining object W and sends reflected light (Re), which is reflected coaxially with L by the machined object (W).
15
Patent
Laser processing system and method
Jieliang Chen
- 10 Nov 2010
TL;DR: In this article, a variable-focus lens device for focusing the laser beam to the target part of work piece, a controller for controlling the working parameters of laser, and a feedback device for feeding back information which can detect and treat the information of target part and feedback said information to the lens device and controller, to adjust the focus and optimize the working parameter of laser.
6
Patent
Beam splitting type laser roughing modulation device
Dejin Hu,Daping Wan,Yu-ming Wang,Zhen-xing Gui,Hongbin Liu +4 more
- 17 Oct 2007
TL;DR: In this article, a dichroic laser texturing and regulating device for texturing process comprised of a continuous laser generator, an expanding telescope, a doubling telescope and a focusing mirror.
6
Patent
Dicing semiconductor wafers
Adrian Boyle,David Gillen,Richard Toftness,Kali Dunne,Eva Fernandes Gomez +4 more
- 01 Nov 2004
TL;DR: In this paper, the non-active rear face of a semiconductor wafer is attached to a carrier and the front face is saw-cut, and a dry etching process using for example xenon difluoride is used to remove any semiconductor material remaining between adjacent dies and to remove surface defects present in the die sidewalls.
5
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