Patent
Laser processing method and equipment
Guo Xin,Jiang Rui,Wang Qian,Zhao Jiangshan,Zhou Yi,Wang Yu +5 more
- 19 Jun 2020
TL;DR: In this paper, the laser processing method and equipment are applied to laser processing of a base; the base contains at least one characteristic phase, and laser processing parameters are obtained from preset correspondence relations of each characteristic phase.
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Abstract: The invention discloses laser processing method and equipment, relates to the technical field of laser processing, and aims to determine appropriate laser processing parameters and improve the laser processing quality during laser processing. The laser processing method is applied to laser processing of a base; the base contains at least one characteristic phase; the laser processing method includes the following steps that laser processing parameter constraint conditions of the at least one characteristic phase are determined according to the processing purpose information; the laser processing parameters are obtained from preset correspondence relations of the at least one characteristic phase according to the laser processing parameter constraint conditions; the preset correspondence relations of each characteristic phase include relative relations of multiple laser processing parameters; and the laser processing equipment processes the base according to the laser processing parameters. The laser processing method and equipment are applied to laser processing.
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References
Patent
Metallic surface with karstified relief, forming same, and high surface area metallic electrochemical interface
Dongfang Yang
- 26 May 2016
TL;DR: In this article, a karstified topography of a metal foil with a surface morphology in which a maximum peak height minus a maximum profile depth is greater than 0.5 μm and extends into the surface at least 5% of the foil thickness, a root mean square roughness is at least about 0.2 μm measured in a direction of greatest roughness, and an oxygen abundance is less than 5 atomic %.
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Patent
Laser energy dynamic distribution model-based ablation depth solving method
Ma Jianwei,He Guangzhi,Jia Zhenyuan,Zhang Ning,Wang Jiacheng,Liu Wei +5 more
- 04 Sep 2018
TL;DR: In this paper, a laser energy dynamic distribution model-based ablation depth solving method is proposed for non-traditional machining, which is based on a part surface energy dynamic model during pulse laser machining.
6
Patent
Laser cleaning and polishing composite processing method for surface of carbon steel
Xie Xiaozhu,Huang Qingpeng +1 more
- 21 May 2019
TL;DR: In this paper, a laser cleaning and polishing composite processing method for the surface of carbon steel is described, in which a nanosecond pulse laser with a certain output energy range is used, so that a corrosion layer can be evaporated; the corrosion layer on the surface is quickly removed by utilizing primary laser treatment; and then laser parameters are adjusted to radiate a cleaned surface to enable a protruding fused object on the carbon steel to flow and fill and solidify a sunken part, and the polished surface with small roughness and improved performance is obtained.
4
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Femtosecond laser processing device and method for rapid deep etching of silicon carbide
Zhao You,Yulong Zhao,Lukang Wang +2 more
- 29 Oct 2019
TL;DR: In this paper, a femtosecond laser processing device and method for rapid deep etching of silicon carbide is presented, where a focal plane is calibrated, a protection layer is prepared, an etching path is planned, layer-by-layer scanning etching is carried out according to parameter groups, and micro-chips are removed.
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