Patent
Laser processing method and device
Kazuhiro Atsumi,Koji Kuno,Masayoshi Kusunoki,Tatsuya Suzuki +3 more
- 13 Dec 2004
67
TL;DR: In this paper, the displacement between one point on a planned cutting line of the object and one end is acquired while the beam reflected by the main surface in correspondence with the irradiation is being detected, and then, with the lens released from the held state and while the position of the lens being adjusted, a reformed region is formed.
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Abstract: Displacement of a laser beam concentration point at an end of an object to be processed is reduced as much as possible, and simultaneously, laser processing is efficiently performed. A laser processing method has displacement acquiring steps (S06-S07) and position setting steps (S08-S09). In the displacement acquiring steps (S06-S07), a second laser beam for measuring the displacement of a main surface of an object to be processed is collected by a lens and irradiated, and the displacement between one point on a planned cutting line of the object and one end is acquired while the beam reflected by the main surface in correspondence with the irradiation is being detected. In the position setting steps (S08-S09), an initial position at which the lens is held relative to the main surface of the object based on the acquired displacement is set and the lens is held at the set initial position. With the lens held at the initial position, a first laser beam for processing is irradiated to form a reformed region at the one end of the planned cutting line, and then, with the lens released from the held state and while the position of the lens being adjusted, a reformed region is formed.
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Citations
Patent
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References
Laser ablation and micromachining with ultrashort laser pulses
X. Liu,D. Du,Gerard Mourou +2 more
TL;DR: In this paper, the mechanisms of ultrashort-pulse laser ablation of materials are discussed, and the differences to that of long laser pulses are emphasized, and some femtosecond laser pulse micromachining results, including comparison with long pulses, are presented.
1.1K
Patent
Laser beam machining method
Fumitsugu Fukuyo,Kenshi Fukumitsu,Naoki Uchiyama,Toshimitsu Wakuda,Kazuhiro Atsumi,Kenichi Muramatsu +5 more
- 12 Mar 2003
TL;DR: In this paper, the authors presented a laser beam machining method characterized by comprising the steps of mounting a protective tape (25) on the surface (3) of a wafer (1a), radiating laser light (L) by using the back (21) as a laser light incidence plane with an optical converging point (P) positioned in a substrate (15), forming a melt processing region (13) for melt processing by multiphoton absorption.
387
Patent
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Fumitsugu Fukuyo,Kenshi Fukumitsu,Naoki Uchiyama,Toshimitsu Wakuda +3 more
- 15 Apr 2005
TL;DR: In this article, the authors present a method for cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, where a pulse laser beam is radiated on the predetermined cut line, and a modified area is formed inside the work along the determined cut line by moving the condensed point along the predetermined cutoff point, whereby the work can be cut with a rather small force by starting from the modified area.
358
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- 28 May 2003
TL;DR: In this article, the authors present a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam, which includes a laser unit for irradiating the laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a precut groove at the starting edge of the marked line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.
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