Patent
Laser processing apparatus
Manabu Mochizuki,Itamochi Mitsuru,Hiroyoshi Hirota +2 more
- 29 Mar 2012
4
TL;DR: In this article, a laser processing apparatus is provided with a first radiation means (31), which radiates a first laser beam (L1) for processing a subject to be processed; a second radiation mean (21, 21, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 17, 18, 19, 20, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 34, 33, 35, 36, 38, 39
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Abstract: A laser processing apparatus (1) is provided with: a first radiation means (31), which radiates a first laser beam (L1) for processing a subject to be processed; a second radiation means (21), which radiates a second laser beam (L2); a first light collecting means (33), which performs processing by forming, on the front surface (S1) or the rear surface (S2) of the subject to be processed, a first light collected area (F1), which is an area where the first laser beam is collected; a second light collecting means (24), which forms, at a predetermined position on the subject to be processed, a second light collected area (F2) where the second laser beam is collected; a light receiving means (26), which receives reflected light (L3) of the second laser beam that is reflected by the subject to be processed; focus servo means (27, 24a), which determine the position of the second light collected area on the basis of the reflected light of the second laser beam, said reflected light being received by the light receiving means; and a control means (33a), which controls the operation of the first light collecting means such that the first light collected area is formed at a position determined on the basis of the position of the second light collected area The numerical aperture of the first light collecting means is larger than that of the second light collecting means
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Citations
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Substrate processing method and substrate processing apparatus
Ikeno Junichi,Yohei Yamada,Hideki Suzuki,Matsuo Rika +3 more
- 04 Nov 2016
TL;DR: In this article, a substrate processing method was proposed for processing a processing object crystal substrate into a processing layer containing substrate for obtaining a crack-free hollow crystal substrate, where a first process is performed for arranging laser condensing means 12, capable of adjusting aberration correction, on an irradiation target face of a processing objects crystal substrate 20a.
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Tatsuyuki Nakagawa,Yasushi Mukai,Atsuhiro Kawamoto,Fujiwara Junji,Matsuoka Noriyuki +4 more
- 02 Jan 2018
TL;DR: In this paper, a welding target is irradiated with a laser beam so as to form a beam spot that moves relatively with respect to the welding target along a locus having a spiral shape rotating around a rotation center moving in a welding direction.
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Method and apparatus for manufacturing hollow composite magnetic member, and fuel injection valve
旭東 張,Zhang Xudong,岡本 晋哉,Okamoto Shinya,小林 信章,Nobuaki Kobayashi,貴博 齋藤,Takahiro Saito,昭宏 山崎,Akihiro Yamazaki +9 more
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TL;DR: In this article, a method for manufacturing a hollow composite magnetic member in which magnetism is weakened in a part of a ferromagnetically formed hollow member, the method including a step of forming a feebly magnetic region, which can be used to prevent cave-ins caused by a feeble magnetization process in a local area of a hollow ferromagnetic pipe.
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References
Patent
Laser processing device
Koji Kuno,Tatsuya Suzuki,Norio Kurita,Tetsuya Osajima +3 more
- 26 Sep 2007
TL;DR: In this paper, the authors present a laser condensing optical system which includes a laser beam source, a condensing system which is arranged between the beam source and a medium and condenses the laser beam in the medium, and a laser divergence point moving unit, which can move the position of the divergence point along an optical axis of the beam along with the refractive index.
77
Patent
Manufacturing method for surface conduction electron emitting element and manufacture thereof
Masahiro Tagawa,昌宏 多川 +1 more
- 13 Mar 1995
TL;DR: In this paper, a position control mechanism was used to adjust a focal point against the surface of a conduction electron emitting element based on information on the surface irregularities of the conductive thin film.
11
Patent
Laser processing apparatus and laser processing method
Kenji Furuta,Keiji Nomaru +1 more
- 04 Aug 2009
TL;DR: In this article, a laser processing apparatus including a holding unit for holding a workpiece, a processing unit for applying a laser beam to the workpiece held by the holding unit, a surface displacement detecting unit for detecting surface displacement, and a focal position adjusting unit for adjusting the position of a focusing lens provided in the processing unit according to the surface displacement detected.
7
Patent
Laser beam machine
Satoru Kubota,哲 久保田 +1 more
- 25 Dec 1992
TL;DR: In this article, a machining head 20 of a laser beam machine has a working part 40 and a range finding part 80, where the laser light beam sent from a laser oscillator 10 is separated to a laserbeam light R1 for machining and a laser beacon light R2 for range finding, and a condensing lens 48, focusing at the upper surface of a work 300 on a table 30 and then machining a work.
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