Patent
Laser processing apparatus
Hiroshi Aoyama,Mori Sadao,Hiroyuki Sugawara,貞雄 森,弘之 菅原,博志 青山 +5 more
- 21 May 2002
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TL;DR: In this paper, a beam splitter is used to split a laser beam into two beams and then reflect the remaining beam to a second light passage, which is processed by a two-dimensional scanner.
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Abstract: PROBLEM TO BE SOLVED: To provide a laser processing apparatus capable of processing a hole with superior quality on a processing target even in the case where laser beams split into two beams is concentrated by one processed lens SOLUTION: A part of a laser beam permeated by a beam splitter 5 is projected into a first light pass, and the rest of the laser beam is reflected to a second light passage The light pass for the laser beam passing through the first light pass and the laser beam passing through the second light pass are joined by a beam splitter 8 Processed targets 20 at two places are simultaneously processed by biassing the laser beam passing through the second light passage at a predetermined angle using a two-dimensional scanner 7 arranged on the second light pass COPYRIGHT: (C)2004,JPO
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Citations
Patent
Methods and systems for thermal-based laser processing a multi-material device
James J. Cordingley,Jonathan S. Ehrmann,David M. Filgas,Shepard D. Johnson,Joohan Lee,Donald V. Smart,Donald J. Svetkoff +6 more
- 07 Nov 2006
TL;DR: In this article, a method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided.
147
Patent
Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
Kelly J. Bruland,Brian W. Baird,Ho Wai Lo +2 more
- 04 Feb 2005
TL;DR: In this article, a semiconductor substrate is arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction, and a first laser beam propagates along a first beam axis that intersects a first target location on or within the substrate.
117
Patent
Method and system for high-speed, precise micromachining an array of devices
Bruce L. Couch,Jonathan S. Ehrmann,Yun Fee Chu,Joseph V. Lento,Shepard D. Johnson +4 more
- 26 Mar 2003
TL;DR: In this article, a method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided.
73
Patent
Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
Kelly J. Bruland,Brian W. Baird,Ho Wai Lo,Stephen N. Swaringen,Frank G. Evans +4 more
- 04 Feb 2005
TL;DR: In this paper, the first and second laser beams are directed onto distinct first-and second-order structures in a row, and the second spot is offset from the first spot by some amount in a direction perpendicular to the lengthwise direction of the row.
43
Patent
Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
Kelly J. Bruland
- 04 Feb 2005
TL;DR: In this paper, a joint velocity profile for simultaneously moving in a lengthwise direction the laser beam axes substantially in unison relative to the semiconductor substrate is determined, so as to process structures in the N rows with the respective N series of laser pulses.
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References
Patent
Laser processing method
Yuji Uesugi,Makino Masashi,Yukio Nishikawa,Kunio Oshima,Akihito Shinohara +4 more
- 21 Dec 1995
TL;DR: In this paper, a flat field lens is used to converge a laser beam reflected on a pair of turning mirrors on a specified plane, and an X-Y stage carries and moves thereon an object to be processed to which the laser beam is applied.
118
Patent
Femtosescond laser system for the exact manipulation of material and tissues
Michael Bergt,Manfred Dick +1 more
- 17 Jan 2003
TL;DR: In this paper, a pulsed laser system with a radiation source was described, with the radiation source being a cavity-dumped fs oscillator, which was used for exact manipulation of organic material.
105
Patent
Laser machining system and method
Adrian Boyle,Oonagh Meighan,Gillian Walsh,Kia Woon Lucan Mah +3 more
- 22 Mar 2002
TL;DR: In this paper, a substrate is machined to form a via, and the machining laser beam is delivered with control of parameters such as pulsing parameters to achieve desired effects.
73
Patent
Laser sputtering apparatus
Yukio Nishikawa,Yoshikazu Yoshida,Kunio Tanaka +2 more
- 14 Dec 1990
TL;DR: A laser sputtering apparatus consisting of a laser oscillator for emitting a pulsed laser beam, an optical unit for uniforming intensity of the laser beam; a vacuum tank which contains a target; and an optical system for irradiating the beam onto the target through the optical unit is described in this paper.
55
Patent
Laser scanner having improved frequency characteristics
Kouichirou Shinohara
- 24 Nov 1992
TL;DR: In this paper, a laser scanner is described, in which the lateral magnification obtained from the first and second optical members, the scanning velocity of the scanning beam on the beam receiving surface and the velocity of acoustic wave inside the acoustic beam modulator are substantially related by M −V 1 /V s, comprising a laser beam emitter, an acoustic optical modulator which generates an acoustic wave having a specified direction of progression, a first optical member to make the primary diffracted beam a collimated beam, a beam deflecting means to deflect the collimated beacon to make it a scanning
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