Patent
Laser beam processing machine
Satoshi Kobayashi,Keiji Nomaru,Yosuke Watanabe +2 more
- 25 Jan 2006
212
TL;DR: In this paper, a laser beam processing machine comprising a path distribution means for distributing a pulse laser beam oscillated by pulse laserbeam oscillation means to a first path and a second path alternately, and one laser beam that passes through one of the paths and is converged by one condensing lens and the other laser beam is applied at different focusing points which have been displaced from each other in the direction of the optical axis.
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Abstract: A laser beam processing machine comprising a path distribution means for distributing a pulse laser beam oscillated by pulse laser beam oscillation means to a first path and a second path alternately, and one laser beam that passes through one of the paths and is converged by one condensing lens and the other laser beam that passes through the other path and is converged by the condensing lens are applied at different focusing points which have been displaced from each other in the direction of the optical axis, alternately with a time lag between them.
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Citations
Patent
Transparent material processing with an ultrashort pulse laser
James Bovatsek,Alan Y. Arai,Fumiyo Yoshino +2 more
- 16 Oct 2009
TL;DR: In this paper, a method for welding transparent materials using ultrashort laser pulses was proposed, where the laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded.
268
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Laser processing apparatus
Yukio Morishige,Hiroshi Morikazu,Toshio Tsuchiya,Koichi Takeyama +3 more
- 05 Jun 2013
TL;DR: In this paper, a laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck tables and the laser beams relative to each other.
140
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Laser processing method
Hiroshi Morikazu
- 09 Jul 2013
TL;DR: In this paper, the relation between the wavelength of the pulsed laser beam and the pulse width generating no cracks is determined by experiment on the basis of the absorption edge of the workpiece, thereby setting the processing conditions.
85
Patent
Laser processing device
Koji Kuno,Tatsuya Suzuki,Norio Kurita,Tetsuya Osajima +3 more
- 26 Sep 2007
TL;DR: In this paper, the authors present a laser condensing optical system which includes a laser beam source, a condensing system which is arranged between the beam source and a medium and condenses the laser beam in the medium, and a laser divergence point moving unit, which can move the position of the divergence point along an optical axis of the beam along with the refractive index.
77
Patent
Method and device for the laser-based machining of sheet-like substrates
Helmut Schillinger,Richard Grundmüller +1 more
- 14 Jan 2014
TL;DR: In this article, a method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beamed onto the substrate, such that an induced absorption is produced in the material of the
70
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Patent
Laser beam machining method
Fumitsugu Fukuyo,Kenshi Fukumitsu,Naoki Uchiyama,Toshimitsu Wakuda,Kazuhiro Atsumi,Kenichi Muramatsu +5 more
- 12 Mar 2003
TL;DR: In this paper, the authors presented a laser beam machining method characterized by comprising the steps of mounting a protective tape (25) on the surface (3) of a wafer (1a), radiating laser light (L) by using the back (21) as a laser light incidence plane with an optical converging point (P) positioned in a substrate (15), forming a melt processing region (13) for melt processing by multiphoton absorption.
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Laser processing method and laser processing apparatus
Fumitsugu Fukuyo,Kenshi Fukumitsu,Naoki Uchiyama,Toshimitsu Wakuda +3 more
- 15 Apr 2005
TL;DR: In this article, the authors present a method for cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, where a pulse laser beam is radiated on the predetermined cut line, and a modified area is formed inside the work along the determined cut line by moving the condensed point along the predetermined cutoff point, whereby the work can be cut with a rather small force by starting from the modified area.
358
Patent
Beam shaping and projection imaging with solid state uv gaussian beam to form vias
Corey M. Dunsky,Xinbing Liu,Nicholas J. Croglio,Ho Wai Lo,Bryan C. Gundrum,Hisashi Matsumoto +5 more
- 26 May 2000
TL;DR: In this article, a diode-pumped solid-state laser (52) of a laser system (50) provides ultraviolet Gaussian output (54) that is converted by a diffractive optical element (90) into shaped output (94) having a uniform irradiance profile.
191
Patent
Multifocal birefringent lens system
Werner J. Fiala
- 01 Aug 1988
TL;DR: In this article, a multifocal birefringent lens system is described together with applications of the lens system such as ophthalmic lenses (including those of the intraocular, contact and spectacle type) and optical instruments and devices including photographic cameras, telescopes, microscopes, copiers, spectrographic instruments, etc.
189
Patent
Laser irradiation method, laser irradiation apparatus, and method for manufacturing semiconductor device
Koichiro Tanaka,Shunpei Yamazaki +1 more
- 25 Feb 2004
TL;DR: In this paper, a fundamental wave is used without putting laser light into a non linear optical element, and laser annealing is conducted by irradiating a semiconductor thin film with pulsed laser light having a high repetition rate.
188