Journal Article10.1063/1.1839637
Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
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TL;DR: In this paper, the reaction of eutectic SnPb solder with electrodeposited laminate Cu is studied and a large number of Kirkendall voids were observed at the interface between Cu3Sn and Cu.
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Abstract: The electronic packaging industry has been using electroless Ni(P)∕immersion Au as bonding pads for solder joints. Because of the persistence of the black pad defect, which is due to cracks in the pad surface, the industry is looking for a replacement of the Ni(P) plating. Several Cu-based candidates have been suggested, but most of them will lead to the direct contact of solder with Cu in soldering. The fast reaction of solder with Cu, especially during solid state aging, may be a concern for the solder joint reliability if the package will be used in a high temperature environment and is highly stressed. In this work, the reaction of eutectic SnPb solder with electrodeposited laminate Cu is studied. Emphasis is given to the evolution of the microstructure in the interfacial region during solid state aging and its effect on solder joint reliability. A large number of Kirkendall voids were observed at the interface between Cu3Sn and Cu. The void formation resulted in weak bonding between solder and Cu and...
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Citations
Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces
H. Tseng,C. T. Lu,Y. Hsiao,P. Liao,Y. Chuang,T. Y. Chung +5 more
Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint
Po-Fan Chan,Hsuan Lee,Shih-I Wen,Mao-Chun Hung,Chih-Ming Chen,Wei-Ping Dow +5 more
- 05 Jan 2020
TL;DR: For pursuing a more comprehensive mechanism of void formation at the Sn/Cu interface, different grain size Cu samples with and without twinned boundaries were electrodeposited in this paper.
Mechanistic Investigation of the Growth of Fe1−xCoxSi (0 ≤ x ≤ 1) and Fe5(Si1−yGey)3 (0 ≤ y ≤ 0.33) Ternary Alloy Nanowires
Jeremy M. Higgins,Penelope Carmichael,Penelope Carmichael,Andrew L. Schmitt,Stephen R. Lee,John P. DeGrave,Song Jin +6 more
TL;DR: Investigation of the pyrolysis of the CoSiCl(3)(CO)(4) precursor revealed independent delivery of Co and Si species during CVD reactions, which enabled a new, more robust two-precursor synthetic route to Fe(1-x)Co(x)Si alloy NWs using Fe(SiCl)(2)(CO)4 and CoCl(2).
Coupling Effect of Electromigration and Joule Heating Induced Failure in Advanced Packaging
Yifan Yao,Yuxuan An,K. Tu,Yingxia Liu +3 more
- 08 Aug 2023
TL;DR: Coupling effect of electromigration and Joule heating induced failure in BGA package leads to open circuit failure.
Solder Reaction with Cu Alloy C7025 and Its Effect on Solder Joint Reliability
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- 28 May 2024
References
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Kejun Zeng,King-Ning Tu +1 more
TL;DR: In this paper, the authors used the format of case study to review six reliability problems of Pb-free solders in electronic packaging technology and conducted analysis of these cases on the basis of thermodynamic driving force, time-dependent kinetic processes, and morphology and microstructure changes.
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Tin–lead (SnPb) solder reaction in flip chip technology
King-Ning Tu,Kejun Zeng +1 more
TL;DR: In this paper, a review of the reactions between SnPb and one of the four metals, Cu, Ni, Au, and Pd have been reviewed on the basis of the available data of morphology, thermodynamics, and kinetics.
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Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening.
H. K. Kim,King-Ning Tu +1 more
TL;DR: In this article, a kinetic analysis of the soldering reaction accompanied by the ripening reaction is given, and a reasonable agreement has been obtained between the calculated scallop-grain growth based on kinetic analysis and the experimentally measured values.
497
Kinetics of interfacial reaction in bimetallic CuSn thin films
King-Ning Tu,R. D. Thompson +1 more
TL;DR: In this paper, the formation of Cu6Su5 between Cu and Sn thin films at room temperature and of Cu3Sn between Cu6Sn5 and Cu at temperatures from 115° to 150°'C were measured by Rutherford backscattering spectroscopy and glancing-incidence X-ray diffraction.
470
Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
T. Y. Lee,W. J. Choi,King-Ning Tu,J. W. Jang,S. M. Kuo,J. K. Lin,D. R. Frear,Kejun Zeng,Jorma Kivilahti +8 more
TL;DR: In this paper, the first phase of intermetallic compound formation in the wetting reaction and the other phases formed in solid-state aging was predicted. But, the morphological change and the large difference in growth rates between the wetter reaction and solid state aging cannot be predicted.
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