Journal Article10.1063/1.1839637
Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
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TL;DR: In this paper, the reaction of eutectic SnPb solder with electrodeposited laminate Cu is studied and a large number of Kirkendall voids were observed at the interface between Cu3Sn and Cu.
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Abstract: The electronic packaging industry has been using electroless Ni(P)∕immersion Au as bonding pads for solder joints. Because of the persistence of the black pad defect, which is due to cracks in the pad surface, the industry is looking for a replacement of the Ni(P) plating. Several Cu-based candidates have been suggested, but most of them will lead to the direct contact of solder with Cu in soldering. The fast reaction of solder with Cu, especially during solid state aging, may be a concern for the solder joint reliability if the package will be used in a high temperature environment and is highly stressed. In this work, the reaction of eutectic SnPb solder with electrodeposited laminate Cu is studied. Emphasis is given to the evolution of the microstructure in the interfacial region during solid state aging and its effect on solder joint reliability. A large number of Kirkendall voids were observed at the interface between Cu3Sn and Cu. The void formation resulted in weak bonding between solder and Cu and...
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Citations
Fabrication of high-temperature-resistant bondline based on multilayer core–shell hybrid microspheres for power devices
TL;DR: In this paper, a fabrication method for high-temperature resistant bondlines based on Cu@Ag@Sn multilayer core-shell hybrid microspheres in which a Ag layer was adopted to accelerate the consumption of a Sn layer was presented.
A Study on the Bonding Process of Cu Bump/Sn/Cu Bump Bonding Structure for 3D Packaging Applications
TL;DR: In this paper, the kinetics of the bonding process of a Cu bump/10 μm thick Sn bonding layer/Cu bump bonding structure, popularly adopted for 3D packaging, and the mechanical properties of the joints were investigated.
Non-destructive micro analysis of electromigration failures in solder microbumps using 3D X-ray computed tomography
TL;DR: In this paper , a 3D X-ray was employed to characterize the electromigration induced failures (voids, cracks, and necking) in 30 μm Cu/Sn/Ni/Cu solder joints.
Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing
Byoung-Joon Kim,Gi-Tae Lim,Jaedong Kim,Kiwook Lee,Young-Bae Park,Ho-Young Lee,Young-Chang Joo +6 more
TL;DR: In this article, the effect of IMC growth on the mechanical reliability of fine-pitch Cu pillar bumps was investigated, and the results showed that as the applied current densities increased, the time required for complete Sn consumption became shorter and Kirkendall voids were observed in both Cu3Sn/Cu pillars and under-bump metallization interfaces.
References
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Kejun Zeng,King-Ning Tu +1 more
TL;DR: In this paper, the authors used the format of case study to review six reliability problems of Pb-free solders in electronic packaging technology and conducted analysis of these cases on the basis of thermodynamic driving force, time-dependent kinetic processes, and morphology and microstructure changes.
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Tin–lead (SnPb) solder reaction in flip chip technology
King-Ning Tu,Kejun Zeng +1 more
TL;DR: In this paper, a review of the reactions between SnPb and one of the four metals, Cu, Ni, Au, and Pd have been reviewed on the basis of the available data of morphology, thermodynamics, and kinetics.
585
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening.
H. K. Kim,King-Ning Tu +1 more
TL;DR: In this article, a kinetic analysis of the soldering reaction accompanied by the ripening reaction is given, and a reasonable agreement has been obtained between the calculated scallop-grain growth based on kinetic analysis and the experimentally measured values.
497
Kinetics of interfacial reaction in bimetallic CuSn thin films
King-Ning Tu,R. D. Thompson +1 more
TL;DR: In this paper, the formation of Cu6Su5 between Cu and Sn thin films at room temperature and of Cu3Sn between Cu6Sn5 and Cu at temperatures from 115° to 150°'C were measured by Rutherford backscattering spectroscopy and glancing-incidence X-ray diffraction.
470
Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
T. Y. Lee,W. J. Choi,King-Ning Tu,J. W. Jang,S. M. Kuo,J. K. Lin,D. R. Frear,Kejun Zeng,Jorma Kivilahti +8 more
TL;DR: In this paper, the first phase of intermetallic compound formation in the wetting reaction and the other phases formed in solid-state aging was predicted. But, the morphological change and the large difference in growth rates between the wetter reaction and solid state aging cannot be predicted.
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