Journal Article10.1063/1.1839637
Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
441
TL;DR: In this paper, the reaction of eutectic SnPb solder with electrodeposited laminate Cu is studied and a large number of Kirkendall voids were observed at the interface between Cu3Sn and Cu.
read more
Abstract: The electronic packaging industry has been using electroless Ni(P)∕immersion Au as bonding pads for solder joints. Because of the persistence of the black pad defect, which is due to cracks in the pad surface, the industry is looking for a replacement of the Ni(P) plating. Several Cu-based candidates have been suggested, but most of them will lead to the direct contact of solder with Cu in soldering. The fast reaction of solder with Cu, especially during solid state aging, may be a concern for the solder joint reliability if the package will be used in a high temperature environment and is highly stressed. In this work, the reaction of eutectic SnPb solder with electrodeposited laminate Cu is studied. Emphasis is given to the evolution of the microstructure in the interfacial region during solid state aging and its effect on solder joint reliability. A large number of Kirkendall voids were observed at the interface between Cu3Sn and Cu. The void formation resulted in weak bonding between solder and Cu and...
read more
Chat with Paper
AI Agents for this Paper
Find similar papers on Google Scholar, PubMed and Arxiv
Write a critical review of this paper
Analyze citations of this paper to find unaddressed research gaps
Citations
Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization
TL;DR: In this article, the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn/3Ag/0.5Cu flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM) under a current stressing condition with an average current density of around 5 kA/cm2 at an ambient temperature of 150°C.
4
Diffusion and Atomic Mobilities in fcc Ni-Sn Alloys
TL;DR: In this article, the atomic mobilities of Ni and Sn in fcc Ni-Sn alloys were assessed as a function of temperature and composition in terms of the CALPHAD method using the DICTRA® software package.
Solid state reaction of Sn3.0Ag0.5Cu solder with Cu(Mn) under bump metallization
Chien-Fu Tseng,Jenq-Gong Duh,Su-Yueh Tsai +2 more
- 23 Sep 2010
TL;DR: In this paper, a novel Cu(Mn) UBM design was provided by sputtering to improve the conventional Cu metallization, and the interfacial reaction was analyzed by a field emission electron probe microanalyzer (FE-EPMA) to evaluate the composition distribution.
4
Effect of Zn content on Cu–Ni cross-interaction in Cu/Sn–xZn/Ni micro solder joints
TL;DR: In this article, the effect of Zn content on cross-interaction in micro solder joints during reflow at 250-°C was investigated and the cross-sectional microstructure, top-view morphology and phase composition of interfacial intermetallic compounds (IMCs) were examined to reveal IMC evolution.
4
Conversion of Precursors into Compound Semiconductors
Jonathan J. Scragg
- 01 Jan 2011
TL;DR: In this paper, the formation of Cu2ZnSnS4 from the precursor is described, and a model is proposed that accounts for the observed sequence of phase formation when a rapid heating rate is used.
4
References
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Kejun Zeng,King-Ning Tu +1 more
TL;DR: In this paper, the authors used the format of case study to review six reliability problems of Pb-free solders in electronic packaging technology and conducted analysis of these cases on the basis of thermodynamic driving force, time-dependent kinetic processes, and morphology and microstructure changes.
1.4K
Tin–lead (SnPb) solder reaction in flip chip technology
King-Ning Tu,Kejun Zeng +1 more
TL;DR: In this paper, a review of the reactions between SnPb and one of the four metals, Cu, Ni, Au, and Pd have been reviewed on the basis of the available data of morphology, thermodynamics, and kinetics.
585
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening.
H. K. Kim,King-Ning Tu +1 more
TL;DR: In this article, a kinetic analysis of the soldering reaction accompanied by the ripening reaction is given, and a reasonable agreement has been obtained between the calculated scallop-grain growth based on kinetic analysis and the experimentally measured values.
497
Kinetics of interfacial reaction in bimetallic CuSn thin films
King-Ning Tu,R. D. Thompson +1 more
TL;DR: In this paper, the formation of Cu6Su5 between Cu and Sn thin films at room temperature and of Cu3Sn between Cu6Sn5 and Cu at temperatures from 115° to 150°'C were measured by Rutherford backscattering spectroscopy and glancing-incidence X-ray diffraction.
470
Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
T. Y. Lee,W. J. Choi,King-Ning Tu,J. W. Jang,S. M. Kuo,J. K. Lin,D. R. Frear,Kejun Zeng,Jorma Kivilahti +8 more
TL;DR: In this paper, the first phase of intermetallic compound formation in the wetting reaction and the other phases formed in solid-state aging was predicted. But, the morphological change and the large difference in growth rates between the wetter reaction and solid state aging cannot be predicted.
256