Integrated circuit resistor structure

TL;DR: In this article, a minimal corrosion resistor structure and deposition technique for superconductive circuits, with mutually protective niobium oxide passivation ring, gold corrosion barrier film and titanium resistive layer, is presented.

Abstract: A minimal corrosion resistor structure and deposition technique for superconductive circuits, with mutually protective niobium oxide passivation ring, gold corrosion barrier film and titanium resistive layer. Niobium has an intrinsic oxide of Nb 2 O 5 , which must be removed from a contact area designated by an opening in photoresist; the development process leaves a photoresist overhang. The gold corrosion barrier film deposition is sharply focused to form an area corresponding to the opening in the photoresist. An unfocused plasma oxidation step, which follows the gold deposition, grows an extrinsic Nb 2 0 5 passivation ring about the gold. The titanium resistive metal is then deposited with a wider focus than that of the gold corrosion barrier film, through the same opening, the titanium resistive metal layer deposits over the edge of the gold, encapsulating the gold with a diffusion barrier.