Proceedings Article10.1364/OECC_PS.2013.WL3_5
High-density optical multi-chip module on waveguide-integrated carrier
Shigeru Nakagawa
- 30 Jun 2013
- pp 1-2
3
TL;DR: Optical multi-chip module enables the integration of high-bandwidth density optical I/Os with high-performance CMOS IC for next-generation high performance computers by mounting optical and electrical chips directly on waveguide-integrated carrier.
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Abstract: Optical multi-chip module enables the integration of high-bandwidth density optical I/Os with high-performance CMOS IC for next-generation high-performance computers by mounting optical and electrical chips directly on waveguide-integrated carrier.
read more
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Citations
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TL;DR: In this paper, the authors show that parallel optical interconnects are fast replacing copper cables today, and that the number of nodes deployed for supercomputers and other high-end compute systems will likely grow at >200% CAGR (deployed Gb/s).
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High-bandwidth, chip-based optical interconnects on waveguide-integrated SLC for optical off-chip I/O
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TL;DR: In this article, the power budget of optical link based on the chip-based optical interconnects is analyzed, since the budget affects the power dissipation of the link, and the fabrication process of the waveguides-integrated SLC is optimized to reduce the loss.
21
High-bandwidth density optical I/O for high-speed logic chip on waveguide-integrated organic carrier
Masao Tokunari,Yutaka Tsukada,Kazushige Toriyama,Hirokazu Noma,Shigeru Nakagawa +4 more
- 20 Jun 2011
TL;DR: In this article, the authors demonstrate a high-bandwidth density optical I/O on a waveguide-integrated organic carrier, which achieves over 10 times higher bandwidth density than conventional optical fiber modules by chip-level packaging and waveguide core pitch reduction, therefore the module supports a nearly 2 Tb/s bandwidth.
12
Is 25 Gb/s On-Board Signaling Viable?
Dong Gun Kam,Mark B. Ritter,Troy J. Beukema,John F. Bulzacchelli,Petar Pepeljugoski,Young H. Kwark,L. Shan,Xiaoxiong Gu,Christian W. Baks,Richard A. John,Gareth G. Hougham,Christian Schuster,Renato Rimolo-Donadio,Boping Wu +13 more
TL;DR: In this paper, the authors present a study of distance and speed limits for electrical on-board module-to-module links with an eye to answering the questions of what package improvements are required for dense, high-aggregate bandwidth buses running at data rates beyond 10 Gb/s per channel and when might optical interconnects on the board be required?