Patent
Heat dissipator including coolant passage and method of fabricating the same
Yoshiyuki Yamamoto,Takahiro Imai +1 more
- 19 Jun 1998
51
TL;DR: In this article, a heat dissipator includes a heat-conductive substrate, a lid and a heatconductive cover layer, and a cooling groove for passing a coolant therethrough is formed on a major surface of the substrate.
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Abstract: A heat dissipator includes a heat-conductive substrate, a lid and a heat-conductive cover layer, and a coolant groove for passing a coolant therethrough is formed on a major surface of the substrate. The lid is positioned on the coolant groove to seal the same, and the cover layer covers the major surface of substrate and the lid. The lid may be received in a lid groove to be flush with the major surface of the substrate. The substrate, lid and cover layer are all made of diamond, and are joined together with substantially no other material therebetween. Thus, a high heat conductivity is achieved. The heat dissipator can be a heat dissipating substrate for an electronic component, or an optical transmission window.
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Citations
Patent
Electroosmotic microchannel cooling system
Kenneth E. Goodson,Chuan-Hua Chen,David E. Huber,Linan Jiang,Thomas W. Kenny,Jae-Mo Koo,Daniel J. Laser,James C. Mikkelsen,Juan G. Santiago,Evelyn N. Wang,Shulin Zeng,Lian Zhang +11 more
- 16 Sep 2002
TL;DR: In this article, the authors describe an electroosmotic pump that is capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as associated reduction in reliability.
365
Patent
Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
Thomas W. Kenny,Mark Munch,Peng Zhou,James Gill Shook,Girish Upadhya,Kenneth E. Goodson,Dave Los Altos Hills Corbin,Mark Mcmaster,James Lovette +8 more
- 30 Oct 2003
TL;DR: In this article, a heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source, which is coupled to the heat source and is configured to pass fluid there through.
203
Patent
Vapor escape microchannel heat exchanger
Peng Zhou,Kenneth E. Goodson,Juan Suntiago +2 more
- 12 Feb 2003
TL;DR: In this article, a vapor escape membrane is proposed for use in a heat exchanging device, including a heat pipe or heat sink that runs liquid into a cooling region positioned adjacent to the heat producing device.
184
Patent
Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
Girish Upadhya,Thomas W. Kenny,Peng Zhou,Mark Munch,James Gill Shook,Kenneth E. Goodson,David Corbin +6 more
- 16 May 2003
TL;DR: In this paper, a micro-channel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to heat exchange region, wherein fluid in the heat exchange regions flows toward a second set of finger and exits the heat-exchange region at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop.
143
Patent
Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
Kenneth E. Goodson,Thomas W. Kenny,Peng Zhou,Girish Upadhya,Mark Munch,Mark Mcmaster,James Hom +6 more
- 30 Oct 2003
TL;DR: In this paper, the authors proposed a method of controlling temperature of a heat source in contact with a heat exchanging surface of heat exchanger, wherein the heat exchange surface is substantially aligned along a plane.
126
References
Patent
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Michel Bruel
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TL;DR: In this article, the process for producing a structure incorporating a substrate (2), a thin surface film (16) made from a nonconducting material joined to one face (1) of the substrate, having cavities (10) flush with said face, is described.
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Patent
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TL;DR: An arrangement of a plurality of microcooling devices provided with electrical components is described in this paper, where the electronic components are arrayed on this cover layer and on the opposite flat side of each micro cooling device.
57
Patent
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TL;DR: A combustion chamber construction includes an inner wall having longitudinally extending cooling channels defined in the exterior thereof and an outer wall which is bonded to the inner wall by galvanizing, both the inner and outer wall are made of a single piece of an oxygen-free copper or equivalent material such as silver or molybdenum as discussed by the authors.
54
Patent
Heat sink and a process for the production of the same
Yoshiyuki Yamamoto,Takashi Tsuno,Imai Takahiro,Fujimori Naoji +3 more
- 09 Jun 1994
TL;DR: In this paper, a diamond heat sink has been proposed for radiation of semiconductor devices or compressors, which includes a plate-shaped diamond substrate and fins for increasing the thermal property.
34