Patent
Gas injection slit nozzle for a plasma process reactor
Dan Maydan,Steve S. Y. Mak,Donald J. K. Olgado,Gerald Zheyao Yin,Timothy D. Driscoll,James S. Papanu,Avi Tepman +6 more
- 09 Jul 1996
276
TL;DR: In this paper, a gas injection apparatus for injecting gases into a plasma reactor vacuum chamber having a chamber housing, a pedestal holding a workpiece to be processed, means for applying RF energy into the chamber, the gas injection device having a gas supply containing an etchant species in a gas, an opening in the chamber housing.
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Abstract: The invention is embodied in a gas injection apparatus for injecting gases into a plasma reactor vacuum chamber having a chamber housing, a pedestal holding a workpiece to be processed, means for applying RF energy into the chamber, the gas injection apparatus having a gas supply containing an etchant species in a gas, an opening in the chamber housing, a gas feed line from the supply to the opening in the chamber housing, and gas distribution apparatus near the opening in the chamber housing, the gas feed apparatus having at least one slit nozzle facing the interior of the chamber. In a preferred embodiment, the gas distribution apparatus includes a disk member surrounded by at least one annular member with a gap therebetween comprising the slit nozzle, the disk member and annular member blocking gas flow through the opening in the chamber housing. Preferably, each of the members of the gas distribution apparatus comprises a material at least nearly impervious to attack from the etchant species. In one example, each of the members of the gas distribution apparatus comprises one of ceramic, quartz, sapphire, polyimide or anodized aluminum and the gas feed line comprises stainless steel. Preferably, each of the members has its surface polished prior to assembly of the gas distribution apparatus.
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Citations
Patent
Electrical biasing of gas introduction means of plasma apparatus
Jeffrey Shane Reiter
- 29 Mar 2004
TL;DR: In this article, a method of treating or processing at least one substrate/workpiece in a plasma comprises steps of: (a) providing an apparatus comprising a chamber defining an interior space; mounting/positioning at least 1 substrate/piece in the interior space, injecting gas(es) into the interior spaces by means of an electrically isolated gas supply, generating a plasma in the internal space; applying a bias potential to the gas supply means to suppress plasma formation at the at least single outlet orifice; and (b) treating/processing the at most one substrate or
4
Patent
Nozzle and plasma apparatus incorporating the nozzle
Ahn-Sik Moon,Joo-Pyo Hong +1 more
- 13 Jan 2006
TL;DR: In this paper, improved nozzles suitable for injecting source gases or other gases into a plasma chamber were presented, in which the gas is conveyed along a single passage or channel to an outlet region at which point the single channel is divided into a plurality of outlet channels.
4
Patent
Plasma reactor having an array of plural individually controlled gas injectors arranged along a circular side wall
Madhavi R. Chandrachood,Michael N. Grimbergen,Khiem K. Nguyen,Richard Lewington,Ibrahim M. Ibrahim,Sheeba J. Panayil,Ajay Kumar +6 more
- 26 Oct 2015
TL;DR: A plasma reactor has an array of plural gas injectors arranged around a circular side wall that are individually controlled as mentioned in this paper, which is called a plasminar plasmon.
4
Patent
Electrode for producing a plasma, plasma chamber having said electrode, and method for analyzing or processing a layer or the plasma in situ
Stefan Muthmann,Aad Gordijn,Reinhard Carius,Markus Hülsbeck,Dzmitry Hrunski +4 more
- 07 Jul 2011
TL;DR: In this paper, the authors propose a method for in situ analysis or in situ processing of a layer or plasma in a plasma chamber, wherein the layer is disposed on counter-electrode and an RF electrode is disposed at the side lacing the layer.
3
Patent
Film removal method and apparatus
Chang Chia Chiang,Chin-Jyi Wu,Chen-Der Tsai,Chun-Hung Lin +3 more
- 01 Apr 2008
TL;DR: In this paper, a film removal method and apparatus for removing a film from a substrate is described, which comprises the steps of disposing a plasma generator and a sucking apparatus over the substrate, projecting a plasma beam from the plasma generator onto the film obliquely, disposing the sucking apparatus on a reflection path of plasma projected by the generator, and sucking a byproduct of an incomplete plasma reaction occurring to the film so as to keep a surface of the substrate clean, with a view to overcoming the drawbacks of deposition of the by-product which results from using the plasma as
3
References
Patent
Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
David Nin-Kou Wang,John M. White,Kam S. Law,Cissy Leung,Salvador P. Umotoy,Kenneth S. Collins,John A. Adamik,Ilya Perlov,Dan Maydan +8 more
- 19 Dec 1986
TL;DR: In this paper, a single wafer, semiconductor processing reactor is described, which is capable of thermal CVD, plasmaenhanced CVD and plasma assisted etchback, plasma self-cleaning, and deposition topography modification by sputtering, either separately or as part of in-situ multiple step processing.
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Patent
A programmable multizone gas injector for single-wafer semiconductor processing equipment
Mehrdad M. Moslehi,Cecil J. Davis,Robert T. Matthews +2 more
- 29 Dec 1992
TL;DR: A programmable multizone fluids injector for use in single-wafer semiconductor processing equipment including an injector having a plurality of orifices therein which are divided into a number of separate zones or areas as mentioned in this paper.
363
Patent
Composite electrode for plasma processes
Raymond L. Degner,Eric Lenz +1 more
- 18 Sep 1990
TL;DR: An electrode assembly for a plasma reactor, such as a plasma etch or plasmaenhanced chemical vapor deposition reactor, comprises an electrode plate having a support frame attached to one surface thereof as mentioned in this paper.
261
Patent
Plasma reactor with programmable reactant gas distribution
Hongching Shan
- 07 Jun 1995
TL;DR: In this paper, a plasma reactor for processing a semiconductor wafer inside a vacuum chamber has an array of gas distribution orifices in said chamber facing respective underlying portions of a top surface of said wafer, a gas flow supply, apparatus for individually coupling gas to respective ones of said gas flow flow supply at respective individual gas flow rates, and apparatus for igniting a plasma inside the vacuum chamber from gases contained therein for processing said Wafer.
216
Patent
Chemical vapor deposition reactor and method of operation
Imad Mahawili
- 28 Jul 1989
TL;DR: In this article, a chemical vapor deposition (CVD) reactor and method is described, where a chamber, preferably configured for receiving a single wafer as a deposition substrate, has multiple gas inlet orifices and exhaust ports which are independently adjustable for dynamically varying and controlling directionality of local gas flow vectors toward and past the deposition substrate.
210
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