Patent
Electronic packaging device and method
Aurelio J. Gutierrez
- 18 May 1999
49
TL;DR: In this article, a device for electrically interconnecting and packaging electronic components is described, where a nonconducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided.
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Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices. In another aspect of the invention, the device includes a series of specially shaped through-holes are provided within the base member to allow the routing of wire leads there through. The bottom surface of the base member is chamfered to facilitate “wicking” of molten solder up the wire leads during soldering, thereby allowing for a stronger and more reliable joint. A method of fabricating the device is also disclosed.
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Citations
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Patent
Advanced electronic microminiature package and method
Russell Lee Machado
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TL;DR: In this article, an advanced microelectronic component package incorporating a specially shaped base element which holds and electrically separates the individual conductors associated with the microelectronics component(s) so that the individual conductsors may be bonded to external package leads and other conductors within the package.
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Patent
Leaded mounting and connector unit for an electronic device
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