Patent
Electroless copper plating composition
Meng Qi,Chum Sze Wai,Li Ping Ling +2 more
- 02 Aug 2018
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TL;DR: In this article, a stabilizer having a chemical structure expressed by formula 1 in an electroless copper plating composition (R1 and R2 are each independent saturated/unsaturated hydrocarbon groups, and one or more of C in the hydrocarbon group may be replaced with N or O) is provided.
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Abstract: PROBLEM TO BE SOLVED: To provide a new stabilizer capable of elongating a bath life by preventing decomposition of an electroless copper plating bath without lowering a deposition rate and a quality of a copper precipitate layer.SOLUTION: There is provided a stabilizer having a chemical structure expressed by formula 1 in an electroless copper plating composition (R1 and R2 are each independent C1-20 saturated/unsaturated hydrocarbon group, and one or more of C in the hydrocarbon group may be replaced with N or O. R1 and R2 may form a ring or a condensed ring in the mutually combined state, and the hydrocarbon group may be substituted with an alkyl group, a cycloalkyl group, an alkoxy group, an aryl group, a heteroaryl group or halogen; X is S or O).SELECTED DRAWING: None
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Citations
Patent
Chemical nickel plating stabilizer and chemical nickel plating solution
Luo Xiumei
- 18 Oct 2019
TL;DR: In this paper, the authors proposed a chemical nickel plating stabilizer that is composed of polyaspartic acid salt, 8-16 parts of citrate, 2-6 parts of carbamic acid ester, 15-25 parts of polyepoxysuccinic acid and 1-3 part of polyethylene glycol.
References
Patent
Imidazole ring-bonded type oxyalkylene compound and plating bath containing the compound
Tetsuji Nishikawa,哲治 西川,Masahiro Sakaegawa,昌宏 榮川,Masakazu Yoshimoto,雅一 吉本 +5 more
- 14 Jul 2011
TL;DR: In this article, a new imidazole ring-bonded type oxyalkylene compound was proposed to satisfy both of solubility in water and defoaming property and to make the management of plating solutions easy, in various kinds of polysilicon plating baths.
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Patent
Electroless copper plating solution composition and electroless copper plating method using same
이홍기,Hong-Kee Lee,전준미,Jun-Mi Jeon,허진영,Jinyoung Hur +5 more
- 19 Nov 2014
TL;DR: In this article, an electroless copper plating solution composition which does not contain a cyano compound or formaldehyde, but contains at least two selected from a group consisting of derivatives of the aldehydes; a reducing sugar with an aldehyde or ketone group; and phosphate derivatives.
9
Patent
Chemical copper plating solution for micropore filling
Wang Zenglin,Zan Lingxing +1 more
- 17 Apr 2013
6
Patent
Pattern of metal film and manufacturing method therefor
Yoshimasa Chikama,Takaharu Hashimoto,Masaaki Ishikawa,Yoshihiro Izumi,Satoshi Kawashima,Toshiharu Yoshikawa,逸治 吉川,良弘 和泉,敏 川島,貴治 橋本,真章 石川,義雅 近間 +11 more
- 22 May 2001
TL;DR: In this paper, the problem of preventing a metal film from depositing on the outside of portions of a pattern, especially portions having width between lines of 10 μm or less, when forming the pattern of the metal film with electroless plating was addressed.
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