Journal Article10.1016/J.MTLA.2019.100400
Effect of the individual layer thickness on the transformation of Cu/W nano-multilayers into nanocomposites
A.V. Druzhinin,A.V. Druzhinin,A.V. Druzhinin,Daniel Ariosa,Sebastian Siol,Noemie Ott,Boris B. Straumal,Boris B. Straumal,Boris B. Straumal,Jolanta Janczak-Rusch,Lars P. H. Jeurgens,Claudia Cancellieri +11 more
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TL;DR: In this article, the role of the individual Cu and W layer thicknesses on the diffusion, internal stress evolution and resulting NC microstructure upon heating by X-ray diffraction, high-resolution scanning electron microcopy and Auger electron spectroscopy was systematically studied.
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About: This article is published in Materialia. The article was published on 01 Sep 2019. The article focuses on the topics: Stress relaxation & Microstructure.
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Citations
Effect of internal stress on short-circuit diffusion in thin films and nanolaminates: Application to Cu/W nano-multilayers
A.V. Druzhinin,A.V. Druzhinin,A.V. Druzhinin,Bastian Rheingans,Sebastian Siol,Boris B. Straumal,Boris B. Straumal,Boris B. Straumal,Jolanta Janczak-Rusch,Lars P. H. Jeurgens,Claudia Cancellieri +10 more
TL;DR: In this article, a combined experimental-modeling approach for deriving stress-free activation energies (and related diffusion coefficients) for the grain boundary diffusion of a given element across an inert barrier nanolayer is presented.
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Achieving both high conductivity and reliable high strength for W-Cu composite alloys using spherical initial powders
Longchao Zhuo,Junlu Zhang,Q.A. Zhang,Hailiang Wang,Zhao Zhao,Qiuyu Chen,Shuhua Liang,Jintao Xu,Aiying Xi +8 more
TL;DR: In this paper, the phase composition and distribution, hardness, electrical conductivity and tensile behavior of the resultant composite alloys were investigated, which can be ascribed to the homogenous structure with alternate soft/conductive Cu and hard W phases free from blind holes.
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Interface and layer periodicity effects on the thermal conductivity of copper-based nanomultilayers with tungsten, tantalum, and tantalum nitride diffusion barriers
Claudia Cancellieri,Ethan A. Scott,Jeffrey L. Braun,Sean W. King,Ron Oviedo,Christopher J. Jezewski,John Richards,Fabio La Mattina,Lars P. H. Jeurgens,Patrick E. Hopkins +9 more
TL;DR: In this article, the thermal conductivity of sputter deposited nanomultilayers with different thicknesses is investigated. And resistive interfacial effects are rationalized and discussed also in relation to the structural transformation into a nano-composite upon high-temperature annealing.
Diffusion mechanism of immiscible Fe-Mg system induced by high-density defects at the steel/Mg composite interface
TL;DR: In this article , the authors improved the interfacial bonding strength by constructing high-density crystal defects at the interface of steel/Mg laminated composites to promote element diffusion.
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The effect of interface stress on the grain boundary grooving in nanomaterials: Application to the thermal degradation of Cu/W nano-multilayers
A.V. Druzhinin,Claudia Cancellieri,Lars P. H. Jeurgens,Boris B. Straumal,Boris B. Straumal,Boris B. Straumal +5 more
TL;DR: In this article, the influence of interface stresses on the energy of interphase boundaries during the thermal degradation of Cu/W nano-multilayers is revealed, as rationalized on the basis of a modified Young equation.
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References
Nanocomposite Coatings: Preparation, Characterization, Properties, and Applications
TL;DR: A review on recent development of nanocomposite coatings is presented in this article, providing an overview of the nanocomposition coatings in various aspects dealing with the classification, preparative method, and characterization methods, and the potential applications in areas such as the anticorrosion, antiwear, superhydrophobic area, self-cleaning, antifouling/antibacterial area, and electronics.
Nucleation Barrier for Volume‐Conserving Shape Changes of Faceted Crystals
W. W. Mullins,Gregory S. Rohrer +1 more
TL;DR: In this paper, the authors consider volume-conserving shape changes of small faceted particles or cavities; these changes are driven by surface-energy reduction, and if these changes require normal motion of the facets (singular surfaces), and if the perimeter free energy sp (per unit area) of a nucleus of a new facet layer is comparable to a typical surface free energy (s ’ 1 J/m 2 ), the energy barrier is prohibitively large for facets larger than a limiting size of approximately a nanometer unless they are intersected by dislocations that provide a
•Book
High Temperature Deformation and Fracture of Materials
Jun shan Zhang
- 01 Jul 2010
TL;DR: In this paper, high temperature deformation of materials and their evolution during creep are discussed.Part 1 High temperature fracture: Nucleation of creep cavity Creep embrittlement by segregation of impurities Diffusional growth of creep cavities Cavity growth by coupled diffusion and creep Constrained growth of curvature growth Creep crack growth Creep damage mechanics Creep damage physics Prediction of creep rupture life Creep - fatigue interaction prediction of creep - fatigue life Environmental damage at high temperature.
160
Stress Determination in Textured Thin Films Using X-Ray Diffraction
Bruce M. Clemens,James A. Bain +1 more
TL;DR: X-ray diffraction and the elastic response of materials provide a powerful method for determining stresses as mentioned in this paper, which can be used to tune the properties of thin film materials and to adjust the bandgap of semiconductors.
158
Bulk and interface stresses in silver-nickel multilayered thin-films
TL;DR: In this article, the difference between the total multilayer film stress and the layer deposition stresses can be attributed to a tensile interface stress of −2.27±0.67 J/m2.
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