Journal Article10.1557/JMR.2016.145
Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration
11
TL;DR: In this paper, an unusual TM phenomenon of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction, which indicated that elevated temperature and sufficient thermal gradient were two major factors that caused TM.
read more
Abstract: Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM.
read more
Chat with Paper
AI Agents for this Paper
Find similar papers on Google Scholar, PubMed and Arxiv
Write a critical review of this paper
Analyze citations of this paper to find unaddressed research gaps
Citations
New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints
TL;DR: In this article, the influence of EM, TM and their coupling effect on microstructure evolution and properties of different joints soldered with pure Sn, SnAgCu, SnBi and SnZn solder.
160
Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient
TL;DR: In this article, a phase field model is developed to simulate the microstructural evolution and phase segregation behavior of the eutectic Sn58Bi solder in a line-type Cu/Sn58Bi/Cu interconnect under the condition of isothermal aging and temperature gradient respectively.
24
Role of alternating current shape on microstructure and damage evolution of solder joints
Waluyo Adi Siswanto,Aleksandr Yu Krasnopevtsev,Ghazal Feizi Talarpoushti,Andino Maseleno,Oleg R. Kuzichkin +4 more
TL;DR: In this article, the microstructural characterization and mechanical properties of solder joints, as vulnerable parts of electronic packages, under different alternating current shapes were investigated for the experiments, and the simulation results showed that the triangle shape current creates the highest thermal fluctuations and stress variations in the solder joints.
4
References
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
TL;DR: In this article, the authors review the unique features of EM and TM in flip-chip solder bumps, emphasizing the effects of current crowding and Joule heating on the dissolution rates of Ni and Cu.
279
Thermomigration in SnPb composite flip chip solder joints
TL;DR: In this paper, the authors used composite flip chip solder joints to study thermomigration and found that Sn has moved to the Si side (the hot end) and Pb to the substrate (the cold end).
158
Electromigration issues in lead-free solder joints
Chih Chen,S. W. Liang +1 more
TL;DR: In this paper, the authors investigated the lifetime of Pb-free solders and found that the melting points of the solders are likely the dominant factor in determining EM lifetimes.
107
Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints
TL;DR: In this paper, failure induced by thermomigration in Pb-free SnAg flip chip solder joints has been investigated by electromigration tests under 9.7×103A/cm2 at 150 °C.
63
In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints
Fan-Yi Ouyang,C.-L. Kao +1 more
TL;DR: In this article, the authors investigated the phenomenon of thermomigration in 96.5Sn-3Ag-0.5Cu flip chip solder joints at an ambient temperature of 150 °C and observed mass protrusion on the chip side (hot end), indicating that Sn atoms moved to the hot end, and void formation on the substrate side (cold end).
52