Journal Article10.1007/S12540-017-6908-1
Die-attach for power devices using the Ag sintering process: Interfacial microstructure and mechanical strength
Byung-Suk Lee,Jeong-Won Yoon +1 more
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TL;DR: In this article, the sintering reaction behaviors of the three sintered joints and identify the relationship between the Sintering behavior and substrate compatibility, and showed that the surface finish material of the substrate strongly affects the shear strength of the Ag sinterered joints.
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Abstract: The sintering reactions and mechanical reliability of Ag sinter paste with three different surface finishes, Cu, Ag, and electroless nickel-immersion gold, were evaluated during the sintering process. We compare the sintering reaction behaviors of the three sintered joints and identify the relationship between the sintering behavior and the sintered Ag/substrate compatibility. Inter-diffusion behaviors result in of good metallurgical bonding during the Ag sintering process in the three sintered joints. The shear strength increases on increasing the bonding pressure, irrespective of the surface finish. The surface finish material of the substrate strongly affects the shear strength of the Ag sintered joints. The Ag finished joint exhibits superior interfacial stability and shear strength compared to the Cu and Au finished joints.
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Citations
Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method
TL;DR: In this article , a framework of crystal plasticity finite element method (CPFEM) is established based on the mechanism of crystal deformation to describe the mesoscopic structural influence of grain evolution on the macroscopic properties of sintered AgNP materials.
69
Die attachment, wire bonding, and encapsulation process in LED packaging: A review
TL;DR: In this article, the authors reviewed and summarized various changes and improvements made to die attachment, wire bonding, phosphor coating, encapsulation processes, and thermal management of light-emitting diodes.
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High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications
TL;DR: The nano-Ag paste consisted of Ag nanoparticles and organic solvents, which would be removed by evaporation or decomposition during sintering as mentioned in this paper, and the resistivity of sintered bulk was 835×× 10−6 Ω cm, and its thermal conductivity was 247 W −m−m−1 K−1 The Si/SiC chips and direct bonding copper (DBC) substrates could be bonded by this nano-ag paste at low temperature.
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Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications
Jeong-Won Yoon,Jong-Hoon Back +1 more
TL;DR: It was confirmed that a high-pressure-assisted sintering process could create relatively dense sintered layers and good interfacial uniformity in the Cu-sintered joints, regardless of the sintered temperatures being in the range of 225–300 °C.
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Effect of surface finish metallization on mechanical strength of Ag sintered joint
TL;DR: In this paper, a micro-sized Ag paste was fabricated with the metal content of approximately 85% as a sinterbonding material in the sintering process and three different surface finishes of Cu, Ag, and electroless Ni-immersion Au (ENIG) were evaluated at different sinter bonding times.
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References
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TL;DR: In this paper, screen/stencil-printable nanosilver pastes were processed and characterized for die-attaching SiC devices, which could enable packaging of wide bandgap semiconductors devices such as SiC or GaN for high-temperature operation.
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Die-attachment solutions for SiC power devices
TL;DR: This work focuses on die attach technologies: solder bonding by means of gold–germanium alloys, adhesive bonding with the use of organic and inorganic conductive compositions, as well as die bonding withthe use of low temperature sintering with silver nanoparticles.
149
Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior
TL;DR: In this paper, the bonding mechanism of silver metallo-organic nanoparticles to bulk materials (gold and copper) is discussed based on the observations of the bonded interface using Transmission Electron Microscope (TEM).
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