Deformation in nanocrystalline metals

TL;DR: In this article, the effect of solutes on the plastic deformation of bimetal interfaces has been investigated and the authors showed that solute segregation at the interface could change the underlying mechanism of interface-facilitated dislocation nucleation and interface sliding.

TL;DR: The most promising approaches that could achieve a breakthrough in research and commercial applications are identified and a detailed comparison of their merits is provided, with special focus on large-scale and reproducible manufacturing of nanogaps.

TL;DR: In this paper, the deformation of nanocrystalline copper and the associated strain accommodation mechanisms at 10 K as a function of grain size were investigated using volume-averaged kinematic metrics based on continuum mechanics theory.

TL;DR: In this article, femtosecond laser processing was used to generate complex stress states due to ultrafast electronic excitation and subsequent relaxation events in nanocrystalline Al-O and Cu-Zr alloys.

TL;DR: In this paper, an atomistic imaging of dislocation nucleation during displacement controlled indentation on a passivated surface is presented, where defects are located and imaged by local deviations from centrosymmetry.

TL;DR: In this article, the authors present an overview of the mechanical properties of nanocrystalline metals and alloys with the objective of assessing recent advances in the experimental and computational studies of deformation, damage evolution, fracture and fatigue, and highlighting opportunities for further research.

TL;DR: In this paper, a periodic relation between shear stress and atomic shear displacement is assumed to hold along the most highly stressed slip plane emanating from a crack tip, which allows some small slip displacement to occur near the tip in response to small applied loading and, with increase in loading, the incipient dislocation configuration becomes unstable and leads to a fully formed dislocation which is driven away from the crack.