Journal Article10.1016/S1359-6454(01)00293-2
Deformation behavior of thin copper films on deformable substrates
Martina Hommel,Oliver Kraft +1 more
236
TL;DR: The role of strain hardening for the deformation of thin Cu films was investigated quantitatively by conducting specialized tensile testing allowing the simultaneous characterization of the film stress and the dislocation density as a function of plastic strain this paper.
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About: This article is published in Acta Materialia. The article was published on 14 Nov 2001. The article focuses on the topics: Strain hardening exponent & Stress–strain curve.
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Citations
Yielding and Strain Hardening in Metallic Thin Films on Substrates: an Edge Dislocation Climb Model
TL;DR: In this article, a simple edge dislocation climb model was used to simulate dislocation processes in passivated, single crystal FCC metal films with a (111) texture, and the model gave a good account of the dependence of the yield strength of passivated gold films on silicon substrates on the film thickness.
14
Thickness and grain size dependence of the strength of copper thin films as investigated with bulge tests and nanoindentations
TL;DR: In this article, the influence of thickness and microstructure on the mechanical properties of thin copper films was investigated via bulge testing and nanoindentation using Han-Nix method.
14
Microstructure of electroplated Cu(Ag) alloy thin films
TL;DR: In this paper, the microstructure of Cu(Ag) alloy films considering the grain evolution as well as silver incorporation and segregation was investigated. And the authors showed that Ag alloying addition prevents room temperature recrystallization.
13
The flow stress in polycrystalline films : Dimensional constraints and strengthening effects
TL;DR: In this article, an analytical model is presented in order to derive a general expression for the flow stress in polycrystalline films which encompasses and correlates dimensional constraints and strengthening effects, and the model is extended to take into account both different grain aspect ratios and distinct strengthening contributions.
13
A simple electrical test method to isolate viscoelasticity and creep in capacitive microelectromechanical switches
TL;DR: In this paper, a bipolar hold-down voltage was used to study mechanical degradation in radio-frequency microelectromechanical capacitive shunt switches, and the characteristics of material stress relaxation and recovery were monitored by recording the change of the pull-in voltage of a device.
13
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