Journal Article10.1016/S1359-6454(01)00293-2
Deformation behavior of thin copper films on deformable substrates
Martina Hommel,Oliver Kraft +1 more
236
TL;DR: The role of strain hardening for the deformation of thin Cu films was investigated quantitatively by conducting specialized tensile testing allowing the simultaneous characterization of the film stress and the dislocation density as a function of plastic strain this paper.
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About: This article is published in Acta Materialia. The article was published on 14 Nov 2001. The article focuses on the topics: Strain hardening exponent & Stress–strain curve.
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Citations
Length-scale-dependent cracking andbuckling behaviors of nanostructured Cu/Crmultilayer films on compliant substrates
TL;DR: In this paper, the effects of the length-scale-dependent deformation and adhesion energies on the buckling behaviors were discussed, and a combined dimensionless parameter of K IC / E f Γ (E f : elastic modulus of the NMF) was proposed to assess the buckle behaviors, and the K IC/Ef Γ contours coincided well with the boundaries dividing the four buckling regimes.
35
A framework for numerical integration of crystal elasto-plastic constitutive equations compatible with explicit finite element codes
TL;DR: In this paper, a numerical integration scheme for elasto-plastic response of single crystals is presented, which is compatible with large-scale explicit finite element codes and can be used for problems involving multiple crystals and also overall behavior of polycrystalline materials.
33
Thermomechanical response and stress analysis of copper interconnects
E. S. Ege,Yu-Lin Shen +1 more
TL;DR: In this article, the constitutive behavior of encapsulated copper film is first studied by fitting the experimentally measured stress-temperature curves during thermal cycling, and significant strain hardening is found to exist.
33
Tensile behaviour of micro-sized copper wires studied using a novel fibre tensile module
TL;DR: In this paper, the influence of the gauge length, wire diameter and grain size on the tensile properties of polycrystalline copper wires was analyzed using a recently developed fiber tensile module capable of high accuracy and flexibility.
33
Size-dependent yield stress in ultrafine-grained polycrystals: A multiscale discrete dislocation dynamics study
TL;DR: In this article , the effects of grain size and dislocation source properties on the yield stress of ultrafine-grained polycrystals were examined using three-dimensional multiscale discrete dislocation dynamics (DDD).
32
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