Patent
Cooled electronic system
Daniel Chester,Peter Hopton,Jason Bent,Keith Deakin +3 more
- 22 Jan 2013
135
TL;DR: In this article, a sealed module, cooled electronic system and method are described relating to cooling a heat generating electronic device, which is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid.
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Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.
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Citations
Patent
Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
Christiaan Scott Best,Mark Garnett +1 more
- 10 Aug 2009
TL;DR: In this paper, the authors present a system for efficiently cooling computing devices having heat-generating electronic components, such as independently operable servers, immersed in a dielectric liquid coolant in a tank.
96
Patent
Pump-enhanced, immersion-cooling of electronic component(s)
Levi A. Campbell,Richard C. Chu,Milnes P. David,Michael J. Ellsworth,Madhusudan K. Iyengar,Roger R. Schmidt,Robert E. Simons +6 more
- 21 Oct 2013
TL;DR: In this article, the authors describe a cooling apparatus that includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic components.
41
Patent
Heat spreading device and method therefore
Vadim Tsoi,Uno Henningsson,Yu Ping Hong,Feng Peng,Hua Yang,Hai Peng Li +5 more
- 18 May 2010
TL;DR: In this article, a heat spreading device of thermo siphon, the device comprising sectioning forming a first chamber portion and a second chamber portion, first plurality of conduits, and second at least two conduits providing interconnection of the first and second chamber portions is disclosed.
26
Patent
System and method for fluid cooling of electronic devices installed in a sealed enclosure
David Lane Smith
- 24 Jun 2015
TL;DR: In this article, the innermost volume of a sealed container contains one or more single phase or multi-phase dielectric thermally conductive fluids, which may be circulated passively by convection or actively by means of a pump, bubbler, fan, propeller or other means.
25
Patent
Active control for two-phase cooling
Timothy J. Chainer,Pritish R. Parida,Joel Abraham Silberman +2 more
- 03 Mar 2015
TL;DR: In this paper, a cooling volume has cavities and active coolant flow controls in the cavities configured to adjust the cooling flow through cavities, and a control module is configured in response to the determined coolant phase condition.
22
References
Patent
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Kenneth E. Goodson,Chuan-Hua Chen,David E. Huber,Linan Jiang,Thomas W. Kenny,Jae-Mo Koo,Daniel J. Laser,James C. Mikkelsen,Juan G. Santiago,Evelyn N. Wang,Shulin Zeng,Lian Zhang +11 more
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TL;DR: In this article, the authors describe an electroosmotic pump that is capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as associated reduction in reliability.
365
Patent
CPU cooling system
Chuan-Fu Chien
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TL;DR: A CPU cooling system for dissipating heat from a CPU in a computer which includes a water cooling type CPU heat dissipating unit fastened to the CPU of the computer for carrying heat away from the CPU as mentioned in this paper.
211
Patent
High density computer equipment storage system
Giovanni Coglitore,Nikolai Gallo,Jack E. Randall +2 more
- 07 Mar 2007
TL;DR: In this paper, the manner in which computers are configured in a given area in order to conserve space and to deal with cooling issues associated with the close housing of a large number of computers is discussed.
177
Patent
Case and rack system for liquid submersion cooling of electronic devices connected in an array
Chad Daniel Attlesey
- 01 Apr 2009
TL;DR: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system is presented in this paper, where a manifold system is used to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases.
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Patent
Semiconductor cooling device
Shigekazu Kieda,Tadakatsu Nakajima,Heikichi Kuwahara,Motohiro Sato +3 more
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TL;DR: A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid.
159
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