Backside thinned image sensor with integrated lens stack

TL;DR: In this article, a microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness.

TL;DR: In this article, a nanowire array is described, which consists of a substrate and a plurality of nanowires extending essentially vertically from the substrate, each of which has uniform chemical along its entire length.

TL;DR: In this article, a method for using a capture device to capture at least two video signals corresponding to a scene was proposed, which includes: providing a two-dimensional image sensor having a plurality of pixels, reading a first group of pixels from the image sensor at a first frame rate to produce a first video signal of the image scene, and then reading a second group of pixel from the camera at a second frame rate for producing a second video signal; and using at least one of the video signals for adjusting one or more of the capture device parameters.

TL;DR: In this article, a method for forming a final digital color image using an image sensor having panchromatic pixels and color pixels corresponding to at least two color photoresponses was proposed.

TL;DR: In this article, a method for implementation of back-illuminated CMOS or CCD imagers is presented, where an oxide layer buried between silicon wafer and device silicon is provided.

TL;DR: In this article, a back-illuminated CMOS image sensor including a matrix of pixels (e.g., CMOS APS cells) is fabricated on a semiconductor substrate.

TL;DR: In this paper, the optical trench structure is made of low dielectric constant material with an index of refraction that is less than the index of the material of surrounding layers (e.g., the substrate).

TL;DR: In this paper, a method of providing metal extension in a backside illuminated image sensor is described, where the first set of pads are electrically coupled to the second sets of pads through the metal layer, and at least one second pad is exposed to the surface of the backside illumination sensor for testing.