Patent
Automatic pattern surface extraction method and shape measuring device thereof
Noboru Azuma,Daisuke Nagai,Kazuo Okamoto,一男 岡本,大介 永井 +4 more
- 12 Dec 2001
7
TL;DR: In this paper, the problem of accurately extracting a pattern surface even in the case that reflection light quantity is reduced in a measurement using light due to roughness having directivity on an electronic substrate surface when the surface is ground for improving contactness of solder by smoothing and activating the surface in producing the electronic substrate.
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Abstract: PROBLEM TO BE SOLVED: To accurately extract a pattern surface even in the case that reflection light quantity is reduced in a measurement using light due to roughness having directivity on an electronic substrate surface when the surface is ground for improving contactness of solder by smoothing and activating the surface in producing the electronic substrate. SOLUTION: A differential image is produced by using a plurality of brilliance images obtained by measuring from a plurality of different directions, a binary threshold is automatically determined by histogram processing and the differential threshold is binarized so that only patterned surface is automatically accurately extracted in the constitution. COPYRIGHT: (C)2003,JPO
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Patent
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Shunichi Ueda
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Patent
Method for inspecting electronic substrate and apparatus using the same
Noboru Azuma,Kenichi Kaita,Daisuke Nagai,健一 戒田,大介 永井 +4 more
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TL;DR: In this article, the authors proposed a method for inspecting electronic substrates and an apparatus using the method whereby all of minute parts arranged on the electronic substrate can be highly accurately extracted without being influenced by a strain amount of the EIs.
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Height measuring method and device
Ishikawa Kazuyuki,Watanabe Nobuyuki +1 more
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TL;DR: In this paper, a laser beam is scanned in two dimensions and applied to the surface of a wafer, reflected lights from the bump 2 and the wafer 3 are detected by a light position detecting part 5, a height measurement value of each measuring point is obtained from quantity if received reflected light.
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