Journal Article10.1016/S1359-0286(00)00036-X
Advances in lead-free electronics soldering
735
TL;DR: In this paper, phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method.
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Abstract: Lead-free soldering has emerged as one of the key technologies for assembling in environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy family is believed to be the first choice with the combination of other alloys such as Sn–Zn–Bi, Sn–Cu and Sn–Bi–Ag. Phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method. The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces, while Cu–Zn compound layers are formed in the Sn–Zn/Cu system. Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed. Creep and fatigue phenomena are also reviewed. In many aspects of lead-free soldering, much more work is required to establish a sound scientific basis to promote their applications.
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Citations
Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection
Yi Qin,Changqing Liu,Geoffrey Wilcox,Kun Zhao,Changhai Wang +4 more
- 01 Dec 2009
TL;DR: A pyrophosphate and iodide-based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloy, which is one of the promising lead-free solder candidates for electronics interconnection as discussed by the authors.
3
Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution
TL;DR: In this paper, a micro-alloying eutectic Sn-9Zn with Al was proposed to improve the corrosion performance of Sn-Zn based solder.
3
Development and Characterization of Sn–Zn–Bi Lead Free Solder
TL;DR: In this article, the microstructure of the alloys were investigated using a scanning electron microscope and energy dispersive x-ray spectroscopy analysis and the tensile test showed that both tensile strength and elongation of alloys reduce on addition of high wt% Bi to the Sn-8Zn solder alloy.
3
Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution
TL;DR: In this article , the effects of S addition on the corrosion behavior of Sn-9Zn solders in 3.5 wt-% NaCl solution were investigated using dynamic potential polarisation, electrochemical impedance spectroscopy techniques and weight loss measurement.
3
References
•Book
Binary alloy phase diagrams
T. B. Massalski,Joanne L. Murray,Lawrence H. Bennett,Hugh Baker +3 more
- 01 Jan 1986
TL;DR: Binary Alloy Phase Diagrams, Second Edition, Plus Updates, on CD-ROM offers you the same high-quality, reliable data you'll find in the 3-volume print set published by ASM in 1990.
16.6K
•Book
Handbook of Ternary Alloy Phase Diagrams
Pierre Villars,Alan Prince,博明 岡本 +2 more
- 01 Oct 1995
TL;DR: The largest collection of ternary phase diagrams and related crystal structure data ever assembled can be found in this 10 volume set.
1.4K
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
Kil-Won Moon,William J. Boettinger,Ursula R. Kattner,Frank S. Biancaniello,Carol A. Handwerker +4 more
TL;DR: In this paper, phase diagram data in the Sn-Ag-Cu system were measured and the location of the ternary eutectic involving L, (Sn), Ag3Sn and Cu6Sn5 phases was confirmed to be at a composition of 3.5 wt.% Ag, 0.91 wt% Cu at a temperature of 216.2±0.3°C.
Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
TL;DR: A review of the literature on the microstructure and mechanical properties of lead-free solders, including Sn-58Bi, Sn-52In, and Sn-3.5Ag, is presented in this paper.
336
Theory for intermetallic phase growth between Cu and liquid Sn-Pb solder based on grain boundary diffusion control
TL;DR: In this article, a model for growth kinetics of an intermediate compound layer is presented for the case where grain boundary diffusion is the predominant transport mechanism, including the geometric effects caused by grain boundary grooving.
319