Journal Article10.1016/S1359-0286(00)00036-X
Advances in lead-free electronics soldering
735
TL;DR: In this paper, phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method.
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Abstract: Lead-free soldering has emerged as one of the key technologies for assembling in environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy family is believed to be the first choice with the combination of other alloys such as Sn–Zn–Bi, Sn–Cu and Sn–Bi–Ag. Phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method. The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces, while Cu–Zn compound layers are formed in the Sn–Zn/Cu system. Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed. Creep and fatigue phenomena are also reviewed. In many aspects of lead-free soldering, much more work is required to establish a sound scientific basis to promote their applications.
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Citations
Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys
TL;DR: In this paper, eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their thermal and electrical properties.
Wettability optimization analysis of lead-free solders with Taguchi method
TL;DR: In this article, the wettability of lead-free solders on substrates with fluxes was studied based on reflow process and Taguchi method, and the effects of different control factors, including solder materials, fluxes, substrate materials and atmosphere, were examined and calculated.
5
Synthesis of Ag3Sn Submicrometer Particles via an Adapted Polyol Process in View of Their Use As Die-Attach Material in Power Modules
Pauline Canaud,Pauline Canaud,Roland Mahayri,Frédéric Schoenstein,Eric Gautron,Ky-Lim Tan,Thierry Chauveau,Jean-Michel Morelle,Fadila Maroteaux,Noureddine Jouini +9 more
TL;DR: In this article, an adapted two-step polyol process was used to synthesize intermetallic Ag3Sn was synthesized in the form of submicrometer particles.
5
Phase Equilibria of the Cu-Si-Sn System at 700 and 500 °C
TL;DR: In this paper, phase equilibria of the Cu-Si-Sn system were investigated for quenched samples annealed at 700 and 500°C for 30 days.
5
Influence of Indium on Microstructure and Properties of Sn-Pb Binary Alloy Applied in Photovoltaic Ribbon
TL;DR: In this paper, the conductivity, melting point, microstructure, spreading behavior, and mechanical properties of three types of Sn-Pb-In(indium) alloys are investigated along with Sn60Pb40 alloy as a reference.
5
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Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
Kil-Won Moon,William J. Boettinger,Ursula R. Kattner,Frank S. Biancaniello,Carol A. Handwerker +4 more
TL;DR: In this paper, phase diagram data in the Sn-Ag-Cu system were measured and the location of the ternary eutectic involving L, (Sn), Ag3Sn and Cu6Sn5 phases was confirmed to be at a composition of 3.5 wt.% Ag, 0.91 wt% Cu at a temperature of 216.2±0.3°C.
Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
TL;DR: A review of the literature on the microstructure and mechanical properties of lead-free solders, including Sn-58Bi, Sn-52In, and Sn-3.5Ag, is presented in this paper.
336
Theory for intermetallic phase growth between Cu and liquid Sn-Pb solder based on grain boundary diffusion control
TL;DR: In this article, a model for growth kinetics of an intermediate compound layer is presented for the case where grain boundary diffusion is the predominant transport mechanism, including the geometric effects caused by grain boundary grooving.
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