Journal Article10.1016/S1359-0286(00)00036-X
Advances in lead-free electronics soldering
735
TL;DR: In this paper, phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method.
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Abstract: Lead-free soldering has emerged as one of the key technologies for assembling in environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy family is believed to be the first choice with the combination of other alloys such as Sn–Zn–Bi, Sn–Cu and Sn–Bi–Ag. Phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method. The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces, while Cu–Zn compound layers are formed in the Sn–Zn/Cu system. Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed. Creep and fatigue phenomena are also reviewed. In many aspects of lead-free soldering, much more work is required to establish a sound scientific basis to promote their applications.
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Citations
Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni
Chi-Won Hwang,Katsuaki Suganuma +1 more
TL;DR: In this paper, the interfacial reactions and the interface microstructures between lead-free solders and Fe-42Ni substrate were investigated at the reaction temperature of 250°C.
18
Performance of TiO2 photocatalyst supported on silica beads for purification of wastewater after absorption of reflow exhaust gas
TL;DR: In this article, the photocatalytic treatment of wastewater containing organic compounds in the exhaust gas from a reflow furnace is studied in a laboratory-scale batch recirculation type reactor system with a packed column of TiO 2 /SiO 2 beads (TiO 2 supported on SiO2 beads).
17
Physicochemical Properties of Sb-Sn-Zn Alloys
TL;DR: In this paper, the effect of Zn concentration in the Sb-Sn-Zn alloys on their density, viscosity, and surface tension was observed, and the experimental results were compared with the results of the Butler model for surface tension and with the Moelwyn-Hughes, Sichen-Boygen and Seetharaman models for viscosities.
The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly
TL;DR: In this paper, a new formulation using Pb-free conducting filler particles was proposed to overcome the critical limitations such as the low conductivity, and unstable contact resistance of ECAs.
17
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Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
Kil-Won Moon,William J. Boettinger,Ursula R. Kattner,Frank S. Biancaniello,Carol A. Handwerker +4 more
TL;DR: In this paper, phase diagram data in the Sn-Ag-Cu system were measured and the location of the ternary eutectic involving L, (Sn), Ag3Sn and Cu6Sn5 phases was confirmed to be at a composition of 3.5 wt.% Ag, 0.91 wt% Cu at a temperature of 216.2±0.3°C.
Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
TL;DR: A review of the literature on the microstructure and mechanical properties of lead-free solders, including Sn-58Bi, Sn-52In, and Sn-3.5Ag, is presented in this paper.
336
Theory for intermetallic phase growth between Cu and liquid Sn-Pb solder based on grain boundary diffusion control
TL;DR: In this article, a model for growth kinetics of an intermediate compound layer is presented for the case where grain boundary diffusion is the predominant transport mechanism, including the geometric effects caused by grain boundary grooving.
319