Journal Article10.1016/S1359-0286(00)00036-X
Advances in lead-free electronics soldering
735
TL;DR: In this paper, phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method.
read more
Abstract: Lead-free soldering has emerged as one of the key technologies for assembling in environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy family is believed to be the first choice with the combination of other alloys such as Sn–Zn–Bi, Sn–Cu and Sn–Bi–Ag. Phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method. The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces, while Cu–Zn compound layers are formed in the Sn–Zn/Cu system. Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed. Creep and fatigue phenomena are also reviewed. In many aspects of lead-free soldering, much more work is required to establish a sound scientific basis to promote their applications.
read more
Chat with Paper
AI Agents for this Paper
Find similar papers on Google Scholar, PubMed and Arxiv
Write a critical review of this paper
Analyze citations of this paper to find unaddressed research gaps
Citations
Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates
TL;DR: In this paper, different amounts of In were added to SnAgBi solder systems to investigate the formation of intermetallic compounds at the interfaces and in the bulk solders under reflows at various temperatures for various durations.
22
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
TL;DR: In this paper, a simulation of the current density distribution indicates that current density is not distributed uniformly, and current crowding occurs inside the bump, and that the increase of current density associated with Joule heating has affected melting and enhanced damage in the solder joint during electromigration.
Phase diagram calculation on Sn–Zn–Ga solders
TL;DR: In this article, gallium (Ga) was added to the Sn-Zn eutectic system in order to improve its melting properties and wetting abilities, and the method of piecing binary phase diagrams proves to be feasible to clarify certain unknown ternary phase systems.
22
Effects of Ni on the nucleation and growth behavior of Cu6Sn5 in Sn–8.5Cu alloy: An in situ observation
TL;DR: In this paper, the nucleation and growth behavior of (Cu, Ni)6Sn5 in Sn-8.5Cu-xNi alloys are in situ investigated using synchrotron X-ray radiography, X-Ray diffraction, and electron probe micro-analyzer.
22
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints
Zeyang Zheng,Ping-Chen Chiang,Yu-Ting Huang,Wei-Ting Wang,Po-Chien Li,Ya-Hui Tsai,Chih-Ming Chen,Shien-Ping Feng +7 more
TL;DR: In this article, the interfacial reactions of the solder joints based on the two Cu films, the Sn-3 wt% Ag-0.5※wt% Cu/Cu and Sn- 3.5µt% Ag/Cu joints were prepared and thermally aged at 150°C.
22
References
•Book
Binary alloy phase diagrams
T. B. Massalski,Joanne L. Murray,Lawrence H. Bennett,Hugh Baker +3 more
- 01 Jan 1986
TL;DR: Binary Alloy Phase Diagrams, Second Edition, Plus Updates, on CD-ROM offers you the same high-quality, reliable data you'll find in the 3-volume print set published by ASM in 1990.
16.6K
•Book
Handbook of Ternary Alloy Phase Diagrams
Pierre Villars,Alan Prince,博明 岡本 +2 more
- 01 Oct 1995
TL;DR: The largest collection of ternary phase diagrams and related crystal structure data ever assembled can be found in this 10 volume set.
1.4K
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
Kil-Won Moon,William J. Boettinger,Ursula R. Kattner,Frank S. Biancaniello,Carol A. Handwerker +4 more
TL;DR: In this paper, phase diagram data in the Sn-Ag-Cu system were measured and the location of the ternary eutectic involving L, (Sn), Ag3Sn and Cu6Sn5 phases was confirmed to be at a composition of 3.5 wt.% Ag, 0.91 wt% Cu at a temperature of 216.2±0.3°C.
Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
TL;DR: A review of the literature on the microstructure and mechanical properties of lead-free solders, including Sn-58Bi, Sn-52In, and Sn-3.5Ag, is presented in this paper.
336
Theory for intermetallic phase growth between Cu and liquid Sn-Pb solder based on grain boundary diffusion control
TL;DR: In this article, a model for growth kinetics of an intermediate compound layer is presented for the case where grain boundary diffusion is the predominant transport mechanism, including the geometric effects caused by grain boundary grooving.
319