Advanced Packaging

TL;DR: A review of the history and development of the field of direct silicon wafer bonding can be found in this article, followed by a summary of the current wafer-bonding model derived from the papers reviewed.

TL;DR: In this paper, a die attach material was used in a pressure free process to bond 2.5mm square Ag plated Si die to Ag and Au plated substrates and the assemblies were stored at 300°C for up to 500h and the morphology of the sintered Ag and the shear strength were monitored as a function of time.

TL;DR: In this paper, the advantages and difficulties of using copper wire in microelectronics packaging and why copper cannot replace gold in many applications, and why gold offers significant benefits over copper.

TL;DR: In this paper, the authors describe progress and initial results achieved towards the goal of developing integrated multi-conductor arrays of shielded controlled-impedance flexible superconducting transmission lines with ultra-miniature cross sections and wide bandwidths over meter-scale lengths.