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About: This article is published in Computer Design archive. The article was published on 01 Sep 1986. and is currently open access.
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Citations
New materials for micro-scale sensors and actuators An engineering review
Stephen A. Wilson,Renaud Jourdain,Qi Zhang,Robert A. Dorey,Christopher R. Bowen,Magnus Willander,Qamar Ul Wahab,Safaa Al-Hilli,Omer Nur,Eckhard Quandt,Christer Johansson,E. Pagounis,Manfred Kohl,Jovan Matovic,Björn Samel,Wouter van der Wijngaart,Edwin Jager,Daniel O Carlsson,Zoran Djinovic,Michael Wegener,Carmen Moldovan,Rodica Iosub,E. Abad,Michael Wendlandt,Cristina Rusu,Katrin Persson +25 more
TL;DR: In this paper, a detailed overview of developments in transducer materials technology relating to their current and future applications in micro-scale devices is provided. And a short discussion of structural polymers that are extending the range of micro-fabrication techniques available to designers and production engineers beyond the limitations of silicon fabrication technology is presented.
Conductive Inkjet-Printed Antennas on Flexible Low-Cost Paper-Based Substrates for RFID and WSN Applications
TL;DR: The first-ever two-dimensional sensor integration with an RFID tag module on paper, as well as the possibility of a three-dimensional multilayer paper-based RF/microwave structure, are shown.
Practical experience with an application extractor for Java
Frank Tip,Chris Laffra,Peter F. Sweeney,David Joseph Streeter +3 more
- 01 Oct 1999
TL;DR: A number of application extraction techniques in Jax, an application extractor for Java, are implemented and evaluated, and their effectiveness on a set of realistic benchmarks is evaluated.
A Review of Hydrophilic Silicon Wafer Bonding
TL;DR: A review of the history and development of the field of direct silicon wafer bonding can be found in this article, followed by a summary of the current wafer-bonding model derived from the papers reviewed.
Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates
TL;DR: In this paper, a die attach material was used in a pressure free process to bond 2.5mm square Ag plated Si die to Ag and Au plated substrates and the assemblies were stored at 300°C for up to 500h and the morphology of the sintered Ag and the shear strength were monitored as a function of time.
115
References
New materials for micro-scale sensors and actuators An engineering review
Stephen A. Wilson,Renaud Jourdain,Qi Zhang,Robert A. Dorey,Christopher R. Bowen,Magnus Willander,Qamar Ul Wahab,Safaa Al-Hilli,Omer Nur,Eckhard Quandt,Christer Johansson,E. Pagounis,Manfred Kohl,Jovan Matovic,Björn Samel,Wouter van der Wijngaart,Edwin Jager,Daniel O Carlsson,Zoran Djinovic,Michael Wegener,Carmen Moldovan,Rodica Iosub,E. Abad,Michael Wendlandt,Cristina Rusu,Katrin Persson +25 more
TL;DR: In this paper, a detailed overview of developments in transducer materials technology relating to their current and future applications in micro-scale devices is provided. And a short discussion of structural polymers that are extending the range of micro-fabrication techniques available to designers and production engineers beyond the limitations of silicon fabrication technology is presented.
Conductive Inkjet-Printed Antennas on Flexible Low-Cost Paper-Based Substrates for RFID and WSN Applications
TL;DR: The first-ever two-dimensional sensor integration with an RFID tag module on paper, as well as the possibility of a three-dimensional multilayer paper-based RF/microwave structure, are shown.
Practical experience with an application extractor for Java
Frank Tip,Chris Laffra,Peter F. Sweeney,David Joseph Streeter +3 more
- 01 Oct 1999
TL;DR: A number of application extraction techniques in Jax, an application extractor for Java, are implemented and evaluated, and their effectiveness on a set of realistic benchmarks is evaluated.
A Review of Hydrophilic Silicon Wafer Bonding
TL;DR: A review of the history and development of the field of direct silicon wafer bonding can be found in this article, followed by a summary of the current wafer-bonding model derived from the papers reviewed.
Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates
TL;DR: In this paper, a die attach material was used in a pressure free process to bond 2.5mm square Ag plated Si die to Ag and Au plated substrates and the assemblies were stored at 300°C for up to 500h and the morphology of the sintered Ag and the shear strength were monitored as a function of time.
115
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